Eastman-kodak Company

Gilbert Alan Hawkins

Christopher Parks

David L Losee

David N Nichols

Madhav Mehra

Robert Leroy Nielsen

An imager, including: a semiconductor substrate; a plurality of spaced image pixels formed in the substrate; and a dielectric layer formed over the image pixels, the dielectric layer having a top surface. The imager further includes a plurality of depressions formed in the top surface; and a plurality of lenses having top surfaces, each lens formed in the depression corresponding to an underlying image pixel, the top surface of each lens being optically planar with the top surface of the dielectric.

Solid state imager with inorganic lens array

A method of making an imager including the steps of providing a semiconductor substrate; forming a plurality of spaced image pixels in the substrate; depositing a dielectric layer over the image pixels and making this layer optically planar by chemical mechanical polishing, thereby forming an optically flat surface. The method further includes forming a plurality of depressions in the optically flat surface; uniformly depositing a lens material on the optically flat surface, entirely filling the depressions; and forming the lens material.

Method for forming inorganic lens array for solid state imager

The imager includes a semiconductor substrate having a top surface. A plurality of depressions is formed in the top surface of the substrate, and a plurality of spaced image pixels is formed in the substrate under the depressions. The imager further includes a plurality of first cylindrical substrate lenses having top surfaces. Each lens is formed in the depression corresponding to an underlying image pixel, with the top surface of each lens being optically coplanar with the top surface of the substrate. The imager further includes a plurality of second lenses overlying the first cylindrical lenses.

Imager having a plurality of cylindrical lenses

A method of making an imager includes the following steps: providing a semiconductor substrate having a top surface; providing a plurality of spaced image pixels h the substrate, thereby forming a semiconductor portion; and depositing a first transparent substantially inorganic support layer over the semiconductor portion. The method further includes the following steps: making the inorganic support layer optically planar by chemical mechanical polishing, thereby forming an optically flat top surface; forming a plurality of depressions in the optically flat top surface; uniformly depositing a substantially inorganic lens material on the optically flat top surface, entirely filling the depressions; and making the substantially inorganic lens material optically planar by chemical mechanical polishing, thereby forming an optically planar lens surface.

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Mendon, NY, United States of America

Gilbert Alan Hawkins