Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Gil Shetrit

Isao Ochiai

Motoaki Wakui

Ron Eyal

The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data &#x394;y which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data &#x394;z on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data &#x394;y and &#x394;z.

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Kiryat Tivon, Israel

Gil Shetrit