Semes Co., Ltd.

Samsung Electronics Co., Ltd.

Gil Hun Song

Oh Jin Kwon

Boong Kim

Sun Yong Park

Seung Hoon Oh

Gui Su Park

Buyoung Jung

Jungbong Choi

Jin Tack Yu

Youngil Lee

Ki Bong Kim

Jonghan Kim

Seungho Lee

Giu Su Park

KiBong Kim

Young Chol Choi

Ki Ryong Choi

A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

Substrate treating apparatus and substrate treating method

Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.

Chemical supply unit and apparatus for treating a substrate

A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.

Apparatus for treating substrate

Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.

Apparatus and method for drying substrate

Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.

Growing community of inventors

Cheonan-si, South Korea

Gil Hun Song