International Business Machines Corporation

Gianluca Rogiani

Stefano Sergio Oggioni

Mauro Spreafico

Giorgio Viero

Michele Castriotta

A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

A stacked via structure () adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks () belonging to three adjacent conductive layers () separated by dielectric layers (), aligned according to z axis. Connections between these conductive tracks are done with at least two vias () between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.

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Milan, Italy

Gianluca Rogiani