Primo1d

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Gianfranco Andia Vera

Jean-François Pintos

Dominique Vicard

Laurent Dussopt

Emmanuel Arene

Christopher Mackanic

Loïc Marnat

Delphine Rolland

A radiofrequency transmission/reception device includes a first and a second conductive wire element, a first far-field transmission/reception chip and a second near-field transmission/reception chip. The first and the second wire element combine with the characteristic impedance of the second transmission/reception chip in order to form a coupling device associated with the first transmission/reception chip at the operating frequency of the first chip. The first and the second wire element combine with the characteristic impedance of the first transmission/reception chip in order to form a coupling device associated with the second transmission/reception chip at the operating frequency of the second chip.

Radiofrequency transmission/reception device

A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.

Method for joining a micorelectronic chip to a wire element

Growing community of inventors

Grenoble, France

Gianfranco Andia Vera