Ge Precision Healthcare LLC

General Electric Company

Giandonato Stallone

Flavien Daloz

Edouard Da Cruz

Coraly Cuminatto

Jean Pierre Malacrida

Philippe Menage

Frederic Lanteri

Edouard Dacruz

Maxence Borot

Jean-Marc Baraban

Alexandre Gilibert

Matthieu Petitprez

Systems and methods are provided for cleanable and sterilizable electrical connector for medical devices. A sterilizable connector may include a first shell and a second shell configured to engage one another, a nose housing that includes a mating area of the connector for engaging a corresponding mating area in a component of a medical device, and an overmolding that overmolds a combination of the first shell, the second shell, and the nose housing. Each of the first shell, the second shell, and the nose housing includes a first material that is compatible with cleaning and sterilization (C&S) treatment. The overmolding includes a second material that provides sealing of the combination of the first shell, the second shell, and the nose housing during the cleaning and sterilization (C&S) treatment. The connector is configured to enable applying at least sterilization without requiring closing or covering of the mating area of the connector.

Cleanable and sterilizable electrical connector for medical devices

Various methods and systems are provided for a transducer for a deployable catheter. In one example, a method for forming the transducer includes coupling an acoustic stack to a shape memory material while in a planar configuration to form a transducer and exposing the shape memory material to a curling stimulus to adjust the transducer to a curved configuration.

Methods for forming an invasive deployable transducer using shape memory polymer

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, a method for the transducer comprises laminating a comb structure and a conductive base package into an acoustic stack with a non-conductive glue, grinding the acoustic stack, and dicing the ground acoustic stack along a plane extending from the top surface of the second fin of the conductive base package to the bottom surface of the acoustic stack. The resulting transducer may have a flat front face with a non-conductive groove separating a ground pad formed by the conductive base package from a signal pad formed by a matching layer of the comb structure.

Ultrasound transducer and method for wafer level front face attachment

Various methods and systems are provided for a deployable invasive device. In one example, the deployable invasive device has a transducer with a plurality of transducer arrays linked by at least one shape memory material, the at least one shape memory material configured to transition the transducer between a first, folded shape and a second, unfolded shape in response to one or more stimuli. When in the second, unfolded shape, an active area of the transducer is increased relative to the first, folded shape.

Methods and systems for a shape-changing invasive deployable device

An ultrasound-enabled invasive medical device and a method of manufacturing the ultrasound-enabled invasive medical device. The ultrasound-enabled invasive medical device includes an invasive medical device, an electrical trace deposited either directly on the surface of the invasive medical device or onto an insulating layer covering at least a portion of the surface of the invasive medical device, where the electrical trace is deposited during an additive manufacturing process. The ultrasound-enabled invasive medical device includes an ultrasound transducer assembly attached to the invasive medical device and electrically connected to the electrical trace, and a transducer support structure attached to the invasive medical device, where the transducer support structure defines a nest that is adapted to receive the ultrasound transducer assembly.

Ultrasound-enabled invasive medical device and method of manufacturing an ultrasound-enabled invasive medical device

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises: a piezoelectric layer, a matching layer, one surface of the matching layer is electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forms a signal pad within a front face of the ultrasound transducer, and a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer. In this way, the transducer can work robustly and may be automatically mounted to a flat substrate with printed circuit.

Growing community of inventors

Nice, France

Giandonato Stallone