Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Gi Jung Kim

Jin Seong Kim

Jae Ung Lee

Ludovico Estrada Bancod

Yung Woo Lee

Robert Lanzone

Mi Kyeong Choi

Edwin Joseph Adlam

Byong Jin Kim

Young Seok Kim

Young Woo Lee

Jin Young Khim

EunNaRa Cho

Tae Kyeong Hwang

Ji Hoon Oh

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Semiconductor package and manufacturing method thereof

An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.

Semiconductor device having EMI shielding structure and related methods

Growing community of inventors

Kyunggi-do, South Korea

Gi Jung Kim