Bridgelux Incorporated

Glo Ab

Luxnet Corporation

Lumileds Lighting U.s., LLC

Kabushiki Kaisha Toshiba

Agilent Technologies, Inc.

Philips Lumileds Lighting Company LLC

Ghulam Hasnain

Steven D Lester

Syn-Yem Hu

Calvin B Ward

Tetsuya Takeuchi

Truls Lowgren

Chihping Kuo

Mark R Hueschen

Hao-chung Kuo

Andrew Shuh-Huei Liao

Zhiqing Shi

Minh Ngoc Trieu

David P Bour

Scott W Corzine

Nathan Fredrick Gardner

Richard P Schneider

Werner K Goetz

Stephen Andrew Stockman

Christopher P Kocot

Norihito Hamaguchi

Danny E Mars

Jeff Ramer

Truls LÖWGREN

A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.

LED-based replacement for fluorescent light source

A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.

Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs

A light source and method for making the same are disclosed. The light source includes a substrate, and a light emitting structure that is divided into segments. The light emitting structure includes a first layer of semiconductor material of a first conductivity type deposited on the substrate, an active layer overlying the first layer, and a second layer of semiconductor material of an opposite conductivity type from the first conductivity type overlying the active layer. A barrier divides the light emitting structure into first and second segments that are electrically isolated from one another. A serial connection electrode connects the first layer in the first segment to the second layer in the second segment. A power contact is electrically connected to the second layer in the first segment, and a second power contact is electrically connected to the first layer in the second segment.

Series connected segmented LED

An opto-electric structure includes a plurality of nano elements arranged side by side on a support layer, where each nano element includes at least a first conductivity type semiconductor nano sized core, and where the core and a second conductivity type semiconductor form a pn or pin junction. A first electrode layer that extends over the plurality of nano elements and is in electrical contact with at least a portion of the second conductivity type semiconductor, and a mirror provided on a second conductivity type semiconductor side of the structure.

Nanowire sized opto-electronic structure and method for manufacturing the same

A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode ('LED') devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices.

Method and apparatus for manufacturing LED devices using laser scribing

Growing community of inventors

Palo Alto, CA, United States of America

Ghulam Hasnain