Vuereal Inc.

Ignis Innovation Inc.

Gholamreza Chaji

Arokia Nathan

Vasudha Gupta

Yaser Azizi

Ehsanollah Fathi

Peyman Servati

Javid Jaffari

Corbin Church

Hossein Zamani Siboni

Kongning Li

Maran Ran Ma

Mehdi Torbatian

Bahareh Sadeghimakki

Won Kyu Ha

Yunhan Li

Aaron Daniel Trent Wiersma

David Hwang

Wissal Mahdi Alayashi

Stefan Alexander

The present disclosure deals with a method of integrating microdevices on a backplane using bonded pads. The process has a substrate having microdevices with bonding of selective microdevices through connecting pads on the microdevices and corresponding pads on the backplane, forming anchors and leaving the bonded selective set of microdevices on the backplane by separating the micro device substrate.

Cartridge inspection anchors

Methods and structures are disclosed for highly efficient vertical devices. The vertical device comprising a plurality of planar active layers formed on a substrate, at least one of a top layer of the plurality of the layers is formed as a plurality of nano-pillars and a passivation layer formed on a space between the plurality of the nanopillars.

Highly efficient microdevices

In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.

Integration of microdevices into system substrate

What is disclosed is structures and methods of integrating micro devices into system substrate. Further, the disclosure, also relates to methods and structures for enhancing the bonding process of micro-devices into a substrate. More specifically, it relates to expanding the micro device area or bonding area of micro devices.

Microdevice cartridge structure

The present invention discloses an optoelectronic system comprising an array of optoelectronic pixels or pixel arrays connected in rows and columns (or other two-dimensional arrays). The pixel arrays also have circuits and optoelectronic microdevices. The controller and driver-based enable the circuits in columns and rows upon an activation signal and pixel data packets. The signals involved can include but are not limited to input data, clocks, address, activation signals, read signals, or output data.

Optoelectronic array

The disclosure is related to creating different functional micro devices by integrating functional tuning materials and creating an encapsulation capsule to protect these materials. Various embodiments of the present disclosure also related to improve light extraction efficiencies of micro devices by mounting micro devices at a proximity of a corner of a pixel active area and arranging QD films with optical layers in a micro device structure.

Method of integrating functional tuning materials with micro devices and structures thereof

An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.

Circuit and system integration onto a microdevice substrate

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

Micro device arrangement in donor substrate

A vertical solid state device comprising: a connection pad; and side walls comprising a metal-insulator-semiconductor (MIS) structure; wherein a gate of the MIS structure is shorted to at least one contact of the vertical solid state device and a threshold voltage (VT) of the MIS structure is adjusted to increase the efficiency of the device.

High efficiency microdevice

What is disclosed structures and methods of integrating micro devices into system substrate.

This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.

Micro device integration into system substrate

This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.

Offset alignment and repair in micro device transfer

The present invention discloses structures and methods for making tiled displays for optoelectronic systems. The invention provides for a method of making a micro device tiled display. The method provides a tile substrate having a plurality of tiles. The method provides for a backplane layer. The method provides for covering a first surface of one of the backplane layer or the tile substrate with an adhesive. The method provides for aligning and releasing the tiles to the backplane. The method provides for curing the adhesive. The method provides for filling an area or a trench between the plurality of tiles and an area or trench between micro devices with a filler layer, wherein the filler layer is extended to either side of the tile depending on the view direction.

Growing community of inventors

Waterloo, Canada

Gholamreza Chaji