Vuereal Inc.

Gholamreza Chaji

Ehsanollah Fathi

Hossein Zamani Siboni

Bahareh Sadeghimakki

Won Kyu Ha

Aaron Daniel Trent Wiersma

Pranav Gavirneni

David Hwang

Wissal Mahdi Alayashi

A vertical solid state device comprising: a connection pad; and side walls comprising a metal-insulator-semiconductor (MIS) structure; wherein a gate of the MIS structure is shorted to at least one contact of the vertical solid state device and a threshold voltage (VT) of the MIS structure is adjusted to increase the efficiency of the device.

High efficiency microdevice

What is disclosed structures and methods of integrating micro devices into system substrate.

Microdevice cartridge structure

This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.

Micro device integration into system substrate

This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.

Offset alignment and repair in micro device transfer

The present invention discloses structures and methods for making tiled displays for optoelectronic systems. The invention provides for a method of making a micro device tiled display. The method provides a tile substrate having a plurality of tiles. The method provides for a backplane layer. The method provides for covering a first surface of one of the backplane layer or the tile substrate with an adhesive. The method provides for aligning and releasing the tiles to the backplane. The method provides for curing the adhesive. The method provides for filling an area or a trench between the plurality of tiles and an area or trench between micro devices with a filler layer, wherein the filler layer is extended to either side of the tile depending on the view direction.

Tiled display for optoelectronic system

Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.

Microdevice integration into system substrate

An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.

Circuit and system integration onto a microdevice substrate

What is disclosed are structures and methods for testing and repairing emissive display systems. Systems are tested with use of temporary electrodes which allow operation of the system during testing and are removed afterward. Systems are repaired after identification of defective devices with use of redundant switching from defective devices to functional devices provided on repair contact pads.

Pixel structure for repairing defects for micro device integrated systems

The present disclosure describes a probe design to measure cycles of microdevices. In particular, the probe comprises, electrodes, dielectric, stimulating capacitor, voltage stimulating source for time varying stimulating voltage signal and a series switch to control biasing condition. The probe structure further has a probe tip and resting pads (ring shape or otherwise) along with a leveling mechanism and apparatus. The disclosure also describes a method to measure cycles of microdevices using the probe structure.

Coupling probe for micro device inspection

As the pixel density of optoelectronic devices becomes higher, and the size of the optoelectronic devices becomes smaller, the problem of isolating the individual micro devices becomes more difficult. A method of fabricating an optoelectronic device, which includes an array of micro devices, comprises: forming a device layer structure including a monolithic active layer on a substrate; forming an array of first contacts on the device layer structure defining the array of micro devices; mounting the array of first contacts to a backplane comprising a driving circuit which controls the current flowing into the array of micro devices; removing the substrate; and forming an array of second contacts corresponding to the array of first contacts with a barrier between each second contact.

Vertical solid-state devices

A micro device structure comprising at least part of an edge of a micro device is covered with a metal-insulator-semiconductor (MIS) structure, wherein the MIS structure comprises a MIS dielectric layer and a MIS gate conductive layer, at least one gate pad provided to the MIS gate conductive layer, and at least one micro device contact extended upwardly on a top surface of the micro device.

High efficient micro devices

A method of aligning a first substrate and a second substrate comprises positioning the first substrate having at least a first alignment mark in close proximity to the second substrate having at least a second alignment mark, measuring an alignment value between the first and second alignment marks of both the first and second substrate; and adjusting the position of the first substrate and the second substrate based on the measured alignment value.

Alignment process for the transfer setup

The present invention relates to the inspection process which includes providing access to the microdevice contacts, measuring the microdevice and analyzing the data to identify defects or performance of the micro device. The invention also relates to the forming of test electrodes on microdevices. The test electrodes may be connected to hidden contacts. The type of microdevices may be vertical, lateral or a flip chip.

Cartridge for inspection

The invention discloses an optoelectronic system may include an array of pixel circuits connected to optoelectronic devices. There can be different types of optoelectronic devices (for example, red, green and blue). These devices can be sensors, or light emitting devices or other types of devices. These devices may be optimized differently and to program the pixel circuits, a configuration of dataline for columns and address lines for rows is used.

Shared pixel circuits

An optoelectronic device comprising a pad substrate comprising an array of pads connected to a driving circuit; and a device layer structure deposited on a substrate, wherein the device layer structure including a plurality of active layers and conductive layers; and a pillar layer formed on or part of a first conductive layer, wherein the pillar layer is patterned into array of pillars to create pixelated micro devices and wherein the array of pillars is bonded to the array of pads. The redundant pillars that are not bonded to the array of pads may be provided a fixed voltage or used as sensors.

Growing community of inventors

Waterloo, Canada

Gholamreza Chaji