Protec Co., Ltd.

Geunsik Ahn

Youn Sung Ko

Yoshiaki Yukimori

According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

Head assembly for mounting conductive ball

Provided is a flip-chip laser bonding system for bonding a semiconductor chip in the form of a flip chip to a substrate using a laser beam. In the flip-chip laser bonding system, the semiconductor chip is laser-bonded to the substrate while pressure is applied to the semiconductor chip. Accordingly, even a semiconductor chip that is bent or is capable of being bent can be bonded to a semiconductor chip without contact failure.

Flip chip laser bonding system

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

System for laser bonding of flip chip

Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.

Flip-chip bonding apparatus using VCSEL device

Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam. The mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

Mask changing unit for laser bonding apparatus

Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

Apparatus for laser bonding of flip chip and method for laser bonding of flip chip

Provided are a semiconductor chip bonding apparatus and a semiconductor chip bonding method, and more particularly, to an apparatus and method of bonding a semiconductor chip to an upper surface of a substrate or another semiconductor chip. According to the semiconductor chip bonding apparatus and the semiconductor chip bonding method, productivity may be increased by quickly and accurately bonding a semiconductor chip to a substrate or another semiconductor chip.

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Seoul, South Korea

Geunsik Ahn