Samsung Electro-mechanics Co., Ltd.

Geum-Hee Yun

Tae-Hoon Kim

Jee-Soo Mok

Jin Cheol Kim

Sang-Jun Yoon

Hwa-Young Lee

Byung-Kook Sun

Chang-Kyu Song

Jun-Rok Oh

Ho-Joon Park

Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.

Light emitting diode package and manufacturing method thereof

Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same

Growing community of inventors

Yongin-si, South Korea

Geum-Hee Yun