Samsung Electro-mechanics Co., Ltd.

Geum Hee Yun

Keun Yong Lee

Hwa Young Lee

Yong Jong Park

Jin Young Kim

Moon Soo Park

Ha Yong Jung

Jun Rok Oh

Jeong Wook Seo

Sa Yong Lee

Su Yeon Lee

Kwan Yeol Paek

Soo Young Yoon

A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.

Capacitor component

A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package.

Fan-out semiconductor package and photosensitive resin composition

Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.

Multilayer inductor and method for manufacturing the same

Disclosed herein is a composition for forming a substrate, including: a compound prepared by polymerizing a liquid crystal thermosetting oligomer having one or more soluble structural units in a main chain thereof and having a thermosetting group at one or more of two ends of the main chain thereof with a fluorine compound having a functional group which can react with the main chain of the liquid crystal thermosetting oligomer.

Composition for forming substrate, and prepreg and substrate using the same

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Suwon-si, South Korea

Geum Hee Yun