Osram Opto Semiconductors Gmbh

Osram Gmbh

Siteco Beleuchtungstechnik Gmbh

Gertrud Kraeuter

Alan Piquette

Adam Scotch

Maxim N Tchoul

Krister Bergenek

Andreas Biebersdorf

Joerg Sorg

Matthias Loster

Joerg-Erich Sorg

Ralph Wirth

Frank Jermann

Reiner Windisch

Stefan Lange

Andreas Dobner

Bert Braune

Bernd Barchmann

Axel Kaltenbacher

David W Johnston

Harald Jaeger

Florian Boesl

Christine Maier

Clemens Meyer

Torsten Pietzonka

The present invention is directed to a wavelength converter comprising a non-luminescent substrate layer, at least one polysiloxane layer, wherein at least one of the polysiloxane layers comprises a phosphor material. Furthermore, the present invention is directed to a method for preparing a wavelength converter, a light emitting device and a method for preparing a light emitting device.

Wavelength converter; method of its making and light-emitting device incorporating the element

The invention relates to a method for producing a conversion element for an optoelectronic component comprising the steps of: A) Producing a first layer, for that purpose: A1) Providing a polysiloxane precursor material, which is liquid, A2) Mixing a phosphor to the polysiloxane precursor material, wherein the phosphor is suitable for conversion of radiation, A3) Curing the arrangement produced under step A2) to produce a first layer having a phosphor mixed in a cured polysiloxane material, which comprises a three-dimensional crosslinking network based primarily on T-units, where the ratio of T-units to all units is greater than 80%, B) Producing a phosphor-free second layer, for that purpose: B1) Providing the polysiloxane precursor material, which is liquid, B2) Mixing a filler to the polysiloxane precursor material, wherein the filler is in a cured and powdered form, wherein the filler has a refractive index, which is equal to the refractive index of the cured polysiloxane material, B3) Curing the arrangement produced under step B2) to produce a second layer having a filler mixed in the cured polysiloxane material, which comprises a three-dimensional crosslinking network based primarily on T-units, wherein the produced conversion element is formed as a plate having a thickness of at least 100 &#x3bc;m.

Methods for producing a conversion element and an optoelectronic component

A wavelength conversion element comprising a crosslinked matrix and at least one phosphor dispersed in said matrix, wherein said matrix is made from a precursor material comprising a precursor having a structure chosen from one of the generic formulae is provided. Further, a light emitting device comprising a wavelength conversion element and a method for producing a wavelength conversion element are provided.

Wavelength conversion element, light emitting device and method for producing a wavelength conversion element

Various embodiments may relate to a sensor unit having a plurality of sensor elements, the detection data of which are used for controlling an opto-electronic light source. According to various embodiments, the plurality of sensor elements are arranged on a substrate body, which is provided in the form of a molded circuit carrier made of a plastic material, and detect different regions and/or sizes.

Sensor unit for light control

Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.

Optoelectronic component with inert gas atmosphere

In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.

Lighting unit having a plurality of light emitting diodes

The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.

Lighting device with LED chip and protective cast

An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

Arrangement for generating mixed light and method for producing such an arrangement

An optical device having a specific form is provided that includes a resin molding compound having an adhesion-reducing, chemically modified surface layer.

Optical device, method of producing the device and optoelectronic component comprising the device

The invention relates to a method for producing an electrical leadframe (), in particular for a light-emitting diode component, having at least one first electrical connection conductor () and at least one second electrical connection conductor ().

Fabricating surface mountable semiconductor components with leadframe strips

The invention relates to a method for producing an electrical leadframe (), in particular for a light-emitting diode component, having at least one first electrical connection conductor () and at least one second electrical connection conductor (). The method includes a) production of a layer composite comprising an electrically insulating carrier layer () and an electrically conductive connection conductor layer (), b) patterning of the carrier layer () in such a way that at least one contact-making window () toward the connection conductor layer () is produced in said carrier layer, and c) patterning of the connection conductor layer (), in such a way that the first electrical connection conductor () and the second electrical connection conductor () are produced, at least one of which can be electrically connected through the contact-making window (). The invention also relates to a leadframe strip having a connection conductor layer and a connection carrier layer, on which an array with a multiplicity of component regions is formed, the connection conductor layer being at least partly removed along separating lines between two adjacent component regions.

Growing community of inventors

Wuppertal, Germany

Gertrud Kraeuter