Intel Corporation

Gerry Juan

Jeff Ku

Gavin Sung

Jason Y Jiang

Tim Liu

Prakash Kurma Raju

Juha Paavola

Arnab Sen

Justin Michael Huttula

Lance Lin

Evan Piotr Kuklinski

Hari Shanker Thakur

Mark Charles Carbone

Vivek Paranjape

Prasanna Pichumani

Daniel J Ragland

Gustavo Fricke

Hua Yang

Harish Jagadish

Kannan G Raja

Gokul V Subramaniam

Kathiravan D

Baomin Liu

Xiyong Tian

Twan Sing Loo

Jia Yan Go

Ruander Cardenas

Columbia Mishra

Ivan By Wang

Christopher M Moore

Ritu Bawa

Chin Kung Goh

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Javed Shaikh

Cora Nien

Wan Yu Liu

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension dof the rectangular form factor is at least approximately twice a first dimension dof the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second dedges of the planar vapor chamber, further disposed to conduct heat from the first and second dedges to the first and second fan respectively.

Vapor chambers

Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

Hybrid thermal cooling system

In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

Movable heat-transfer system

Growing community of inventors

Taipei, Taiwan

Gerry Juan