Infineon Technologies Ag

Gerrit Utz

Michael Lenz

Ricardo Erckert

Gerhard Zojer

Claudia Kabusch

Daniel Auer

One aspect of the invention relates to a semiconductor chip with a semiconductor body. The semiconductor body has an inner region and a ring-shaped outer region. An electronic structure is monolithically integrated in the inner region and has a controllable first semiconductor component with a first load path and a first control input for controlling the first load path. Further, a ring-shaped second electronic component is monolithically integrated in the outer region and surrounds the inner region. Moreover, the second electronic component has a second load path that is electrically not connected in parallel to the first load path.

Semiconductor chip and semiconductor arrangement

A protection arrangement for a power semiconductor component made of a plurality of cells, in which a current sensor made of a current sense transistor and current sense resistors and also a temperature sensor, is disclosed. The current sense transistor and the temperature sensor are provided in a gap or in different gaps between the cells, while the current sense resistor is fitted directly on at least one cell. The temperature sensor may, include a plurality of stages which are located from the center of the power semiconductor component to an edge of the latter in the gap between two cells.

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Regen, Germany

Gerrit Utz