U.S. Philips Corporation

Gerrit J Van Der Kolk

Johan P Duchateau

Bernard Dam

Theunis S Baller

Maritza G Heijman

Andries R Miedema

Frans W Saris

Alec H Reader

Roger De Reus

A method of manufacturing a semiconductor device whereby a layer (12) containing Co or Ni is deposited on a surface (2) of a semiconductor body (1) bounded by silicon regions (3, 4, 5, 6) and regions of insulating material (8, 9), after which the semiconductor body (1) is heated during a heat treatment to a temperature at which the Co or Ni forms a metal silicide with the silicon (3, 4, 5, 6), but not with the insulating material (8, 9). On the surface (2) of the layer (12) containing the Co or Ni, according to the invention, a layer of an amorphous alloy of this metal with a metal from a group comprising Ti, Zr, Ta, Mo, Nb, Hf and W is deposited, while furthermore the temperature is so adjusted during the heat treatment that the layer (12) of the amorphous alloy remains amorphous during the heat treatment. In this way a metal silicide is formed on the silicon regions (3, 4, 5, 6) only and not on the regions of insulating material ( 8, 9) directly adjoining them; in other words, the method yields a self-aligned metal silicide.

Method of manufacturing a semiconductor device whereby a self-aligned

A device comprising semiconductor elements and conductor tracks of an oxidic superconducting material, electrically conductive connections being formed between semiconductor elements and conductor tracks, is provided with an electrically conductive antidiffusion layer between the semiconductor elements and the conductor tracks. The antidiffusion layer is composed of an amorphous alloy having the composition A.sub.x E.sub.1-x, wherein A is selected from one or more of the elements Zr, Nb, Mo, Ru, Rh, Pd, Hf, Ta, W, Re, Os, Ir and Pt, wherein E is selected from one or more of the elements B, Si, Al, Ga and Ge, and wherein x has a value of from 0.7 to 0.95.

Device and method of manufacturing a device

A device comprising semiconductor elements and conductor tracks of an oxidic superconductive material, electrically conductive connections being established between the semiconductor elements and the conductor tracks, is provided with an electrically conductive antidiffusion layer between the semiconductor elements and the conductor tracks. The antidiffusion layer consists of an amorphous alloy of two transition metals, which alloy has a crystallization temperature of at least 900 K. The amorphous alloy has the composition A.sub.x B.sub.1-x, wherein A is selected from Ti, Zr, Hf, Nb and Ta, wherein B is selected from Ir, Pd and Pt, and wherein x has a value from 0.4 to 0.8.

In a method of manufacturing a device comprising a film of an oxide superconducting material which comprises an alkaline earth metal, another metal component, copper and oxygen. A superconductor precursor material comprising copper oxide, alkaline earth metal fluoride and another metal or metal oxide, is provided on a substrate in the form of a film. The film is covered with a diffusion barrier against water in accordance with a pattern which is complementary to a desired pattern of superconducting material. Subsequently, the superconducting material is formed in the uncovered portions of the pattern by means of a treatment at an increased temperature in the presence of water and oxygen.

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Eindhoven, Netherlands

Gerrit J Van Der Kolk