Infineon Technologies Ag

Gerrit F&auml;rber

Frank Weber

Jens M&ouml;ckel

Martin Fritz

Michael H&uuml;bner

A method for releasable contact-connection of a plurality of integrated semiconductor modules on a wafer, each of which having a plurality of interconnected supply voltage terminals, includes the steps of providing a contacting card for applying external electrical signals to the semiconductor modules with contact elements for releasable electrical connection to terminal pads of the semiconductor modules, aligning the contacting card with the wafer, producing a releasable contact between terminal pads of the plurality of semiconductor modules and the contact elements of the contacting card, checking the contact quality for each of the semiconductor modules by applying a voltage to at least one of the supply voltage terminals of the semiconductor module through the contacting card, measuring the voltage present at a further one of the supply voltage terminals through the contacting card, and using the measurement result to assess whether or not the semiconductor module has correct contact.

Growing community of inventors

München, Germany

Gerrit Färber

Growing community of inventors

München, Germany

Gerrit F&auml;rber

Gerrit Färber