Altana Electrical Insulation Gmbh

Schenectady International Inc.

Basf Lacke+farben Ag

Elantas Gmbh

Dres. Fitznee, Muench & Kluin

Schenectady Europe Gmbh

Gerold Schmidt

Klaus-Wilhelm Lienert

Helmut Lehmann

Klaus Wilhelm Lienert

Sascha Tödter-König

Rainer Blum

Roland Peter

Andreas Steinmann

Klaus-W Lienert

Kim Bastian Bebenroth

Michael Schink

Sascha Tödter König

Klaus-Wilhelm Liener

One-component, solvent-free organosiloxane composition comprising 

One-component, solvent-free organosiloxane composition for application to printed circuit boards by means of a cross-cut nozzle

The invention relates to an overcoat lacquer containing a) at least one binding agent containing alkyd resins made from tris-(2-hydroxylethyl)-isocyanurate, 2,6-naphthaline dicarboxylic acid, drying fatty acids, and, optionally, other components known from alkyd resin chemistry, b) at least one solvent or at least one technical solvent or mixture thereof based on hydrocarbon and c) at least one siccative or at least one mixture of siccatives or several anti-skin agents.

Overcoat lacquer

The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170&#xb0; C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.

Polyamide-imide resin solution and the use thereof for producing wire enamels

The invention relates to novel liquid epoxy resin emulsions which contain the following components, dissolved and/or dispersed in water: (A) at least one binding agent selected from the group made of epoxy resins and modified epoxy resins, (B) at least one non ionic thickener and (C) at least one catalyst for hardening, produced by reacting at least one boron trifluoride complex with at least one compound containing at least one epoxy group. The invention also relates to a method for the production and use thereof as an impregnating varnish for electrotechnical components, particularly for electrical winding items.

Liquid epoxy resin emulsions, method for the production and use thereof

A coating for enamelled wire having a base coat and a top coat, and enamelled wire having such coating. The top coat contains a binder, titanium dioxide and pyrogenic silica.

Coating which is resistant to partial discharges, for enamelled wire

The invention relates to wire enamels comprising as binders polyesterimide and/or polyamideimide, the binders comprising as monomeric building blocks polyoxyalkylenediamine having terminal amino groups. The polyoxyalkylenediamines are preferably selected from the group polyoxyethylenediamine, polyoxypropylenediamine and polyoxyethylenepropylenediamine. The invention also encompasses the use of the novel wire enamels for coating copper wires, especially thick round wires or profiled wires.

Wire enamels containing polyesterimides and/or polyamideimides with polyoxyalkylenediamines as molecular elements

The invention relates to mixtures of preferably from 80 to 99.9% by weight, based on the mixture, of a solution S1 comprising one or more polyamidocarboxylic acids and preferably from 0.1 to 20% by weight, based on the mixture, of a solution S2 comprising one or more, preferably primary, diamines and one or more tetracarboxylic acid diesters, processes for producing polyimide coatings using such mixtures, the use of such mixtures for producing polyimide coatings, and also polyamide-coated articles obtainable using such mixtures.

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Hamburg, Germany

Gerold Schmidt