Siemens Aktiengesellschaft

Gernot Schimetta

Karl Weidner

Franz Fadler

Franz Dirauf

Jörg Zapf

Axel Kaltenbacher

Robert Weinke

Michael Kaspar

Stefan Setzer

Maximilian Tschernitz

Maximilian Tschemitz

Franz Dollinger

The present embodiments relate to a radiation generation unit for a therapy system. The radiation generation unit has a radiation source and support components for the radiation source. The radiation generation unit includes a power source and has a mechanical interface, with which the radiation generation unit may be attached to a stand. Degrees of freedom of movement may easily be implemented using a corresponding movement of the radiation generation unit.

Radiation generation unit

Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is arranged inside a window in a first layer on a substrate. Next, a second layer is put on such that contact areas on the component and contact points on the first layer are freely accessible. Electrical contacts and electrical connecting lines are produced by electrodeposition. The second layer is used to produce bridges over an interval range between the electronic component and the first layer. The bridges have connecting lines formed on them. The second layer can be removed again. Radio-frequency modules can be produced in compact fashion and can be combined with audio-frequency components.

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Method for contacting electronic components by means of a substrate plate

The product comprises a sensor ( ) via which a measured quantity that corresponds to reactive resistance can be furnished within a measuring range. The product also comprises a matching network ( ) and a surface wave element ( ). The sensor ( ) is connected to a first reflector ( ) of the surface wave element ( ) via the matching network ( ). The first reflector ( ) forms, together with the matching network ( ) and the sensor ( ), a resonator which, for a value of the measured quantity within the measuring range, has a resonance with regard to a reflection of an acoustic surface wave on the first reflector ( ). The invention also relates to a method for determining the measured quantity and to a corresponding system.

Product having a sensor and a surface acoustic wave element, as well as a method and arrangement for determining a measurement variable, which corresponds to a reactance, by a sensor

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Munich, Germany

Gernot Schimetta