Infineon Technologies Ag

Qimonda Ag

Germar Schneider

Walter Leitgeb

Matthias Taubert

Thomas Gadau

Markus Pfeifenberger

Frank Boenewitz

Michael Mitrach

Arthur Deutschlaender

Harald Heinrich

Steffen Schroeder

Pierre-Louis Saez

Gerd Brueckner

Feryel Zoghlami

Okan Kamil Sen

According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.

Frame cassette for holding tape-frames

According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.

Frame cassette

A method and apparatus for handling an article in semiconductor fabrication in which the article is completely separated from a gripper by a frozen liquid. The gripper includes a feeding device for introducing a liquid such as a high-purity water or a decontaminating liquid. The gripper also includes a cooling device for freezing the liquid. A suction take-in device applies negative pressure to hold the article against the frozen liquid.

Method and device for handling an article in the course of semiconductor fabrication

The invention relates to a process for chemically mechanically polishing and grinding wafers. The CMP slurry that is used for grinding is analyzed using slurry atomic absorption spectroscopy. This allows rapid and sensitive analysis of the slurry constituents, in particular of interfering ions. The process can be automated and makes it possible to process wafers with a constant quality. Furthermore, rapid fault analysis or optimization of the process parameters used during the grinding is possible.

Process for chemically mechanically polishing wafers

An exhaust apparatus for a treatment unit of electrical components, preferably wafers, particularly for a spray tool to clean electrical components, is described. To ensure that particles of a size greater than or equal to 0.16 &mgr;m in diameter can be reliably removed from the treatment unit, which particles would otherwise cause contamination of the electrical components, the exhaust apparatus is provided with a main exhaust pipe and a side pipe. The main exhaust pipe has an outside pipe and an inside pipe, whereby the inside pipe is equipped with a number of nozzles. The side pipe connects the treatment unit with the main exhaust pipe and which has an outside pipe and an inside pipe, whereby the inside pipe is equipped with a number of nozzles. The inside pipes are connected with a source of a cleaning fluid such that the cleaning fluid at least intermittently flows through the inside pipes for the purpose of rinsing. The side pipe and the main exhaust pipe are connected with each other at a certain angle. Furthermore, the side pipe is made of several partial areas that are aligned at a certain angle with respect to each other. Furthermore, an additional exhaust pipe, which connects the main exhaust pipe with a clean room, is provided.

Exhaust apparatus

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Dresden, Germany

Germar Schneider