Olin Corporation

Goodrich Corporation

Advanced Technology Interconnect Incorporated

German J Ramirez

Paul R Hoffman

Dexin Liang

Deepak Mahulikar

George A Brathwaite

Michael A Holmes

Arvind Parthasarathi

Andrew J Brock

Efraim Sagiv

Satish K Jalota

Jeffrey M Schlater

Linda E Strauman

Serafin Padilla Pedron, Jr

Anthony M Pasqualoni

Brian Wilson

Kambhampati Ramakrishna

Michael A Raftery

Serafin P Pedron, Jr

Patrick Carver

George A Erfe

Salvador A Tostado

Sonny S Pareno

Richard McNabb

Francis S Jewell

A pressure delay mechanism is disclosed. In various embodiments, the mechanism includes a triggering mechanism operably coupled to an input signal port and to an output signal port and configured to transmit a signal from the input signal port to the output signal port and a differential pressure mechanism operably coupled to an exterior pressure input and to an interior pressure input and configured to lock the triggering mechanism during a first state of pressure difference and to unlock the triggering mechanism during a second state of pressure difference.

Inert ambient pressure delay

A variable stand-off distance explosive cord assembly for a casing is disclosed. In various embodiments, the assembly includes an explosive cord configured for positioning at a stand-off distance from the casing and a thermally responsive material configured to vary the stand-off distance from a first distance to a second distance.

Variable stand-off assembly

A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.

Exposed heat spreader with seal ring

A semiconductor package is provided that has a rigid metal substrate and a dielectric layer covering a first portion of the rigid metal substrate, with a second portion of the rigid metal substrate being substantially free of the dielectric layer. A semiconductor device is electrically bonded to the second portion of the rigid metal substrate and metal circuit traces defining electrical paths are formed on the dielectric layer, at least one of which contacts the rigid metal substrate through at least one via in the dielectric layer. Additionally, a method is provided for grounding a semiconductor device and at least one circuit trace on a rigid metal substrate substantially covered by a dielectric layer, which includes creating at least one via in the dielectric layer using a laser and creating circuit traces on the dielectric layer, at least one of which contacts the rigid metal substrate through at least one of the vias. The semiconductor is electrically bonded to the rigid metal substrate in an aperture in the dielectric layer.

Semiconductor package having a ground or power ring and a metal substrate

There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Anodized aluminum substrate having increased breakdown voltage

There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.

Polymer plug for electronic packages

There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component.

Chamfered electronic package component

There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.

Electronic package having controlled epoxy flow

Growing community of inventors

Antioch, CA, United States of America

German J Ramirez