At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Gerhard Schmid

Johannes Stahr

Gerald Weidinger

Andreas Zluc

Markus Leitgeb

Hannes Voraberger

Markus Riester

Ljubomir Mareljic

Volodymyr Karpovych

Volodymyr Karpowych

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity

Methods for the production of a circuit board involving the removal of a subregion in accordance with various embodiments of the invention are disclosed. In one embodiment, the production of a circuit board, made of at least two interconnected layers of material, involving the removal of a subregion including a portion of at least one of the at least two interconnected layers from the circuit board includes providing an adhesion preventing material under the subregion to be removed to a layer in the at least two interconnected layers that is adjacent to the at least one layer including the subregion, separating edge regions of the subregion to be removed from adjoining regions of the circuit board, connecting an external surface of the subregion to be removed to an external element, and displacing the external element to separate the subregion to be removed from the adjacent layer of the circuit board.

Method for the production of a circuit board involving the removal of a subregion thereof

A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:&#x2014;providing the printed circuit board having a plurality of contact and connection pads,&#x2014;providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and&#x2014;arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.

Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

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Trofaiach, Austria

Gerhard Schmid