Ems Inventa Ag

Ems-chemie Ag

Fms-inventa Ag

Gerhard Poessnecker

Eberhard Kinkelin

Jurgen Spindler

J&uuml;rgen Spindler

Low-melting copolyamide and their use as hot-melt adhesives

The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid and a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, diethylene glycol, polyethylene and optionally triethylene glycol is present as diol component. The molar amount of butane diol is less than 75 molar %, the amount of diethylene glycol is between 5 and 60 molar %, the amount of triethylene glycol between 0 and 40 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 190.degree. C. The copolyetherester hot-melt masses can be used in the hot-melt method and for the known other powder coating methods.

Copolyether ester hot-melt masses

The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid in a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, triethylene glycol and polyethylene glycol is present as diol component. The molar amount of butane diol is less than 80 molar %, the amount of triethylene glycol is between 15 and 60 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 180.degree. C. The copolyetherester hot-melt masses can be used in the hot-melt method and for other known powder coating methods.

Hot-melt adhesives are based on a random copolyetherester formed from aromatic dicarboxylic acids, terephthalic acid and isophthalic acid wherein the molar proportion of terephthalic acid is at least 55% based on the acid content, with a butanediol content between 20 and 85 mol % and containing at least 10 mol % triethylene glycol; the remainder of the diol content is preferably diethylene glycol. Copolyetheresters of this type are distinguished by excellent adhesion properties, a low melting point, rapid crystallization, and good resistance to laundering and dry cleaning at a minimum viscosity of 80 Pas.

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Trin, Switzerland

Gerhard Poessnecker