Siemens Aktiengesellschaft

Gerhard Mitterhummer

Franz Auracher

Hanns-Heinz Peltz

Karl-Heinz Zeitler

Kurt Plehnert

Fritz Conzelmann

Heinrich Mayer

A device for coupling an incoming light conducting fiber cable to an outgoing light conducting fiber cable characterized by a pair of housings connected together and each receiving a holder which holders center the fibers in one cable in relation to the fibers of the cable which is centered by the other holder. The improvement comprises the holder includes a substrate having a first guide foil disposed on one surface and a second guide foil disposed on the opposite surface, each of said foils having aligned channels for receiving light conducting fibers with the channels of the first foil in a direction leading away from the substrate possessing a cross-sectional profile, decreasing to the diameter of the light conducting fibers. In one embodiment of the invention, the channels are apertures which are aligned with apertures or bores in the substrate and a modification of this embodiment includes forming the first guide foil of a plurality of layers with each layer having apertures converging towards the outer surface thereof with the outermost layer having the smallest aperture. In another embodiment, the channels in the first and second guide foils are arranged as perpendicular channels which extend beyond the peripheral surface of the substrate and, preferably, the light conducting fibers received in the channels are secured on the periphery of the substrate.

Device for coupling two light conducting fiber cables

A method and apparatus for producing micro-wiring arrangements on a flexible, insulating carrier band for the purpose of contacting semiconductors characterized by providing a carrier band having at least one opening therein for subsequently receiving an assembly, a thin metal band bonded onto one side of the carrier band with a first layer of photosensitive varnish covering the metal layer and a second layer of photosensitive varnish covering the opposite side of the carrier band and any metal exposed through the openings therein, and after exposing the first layer with the desired pattern, treating the layer to uncover portions of the metal layer by floating the band across a surface of a treating bath such as a developing bath to contact the first layer without contacting the second layer with the developing material and creating a flow in the bath directed generally toward the first layer to contact the first layer and to thereby cause developing of the first layer to uncover portions of the metal layer. The method further includes using a similar device to remove the remaining portion of the first layer in a layer removing bath by floating the band across the surface of the layer removing bath without contacting the second layer with the liquid of the layer removing bath and while floating the band across the bath producing or creating a flow in the bath to contact the entire surface of the first layer to ensure removal thereof.

Method for manufacturing micro-wiring arrangements for contacting

Method of producing a metallic carrier system mounting, making conductive contact with a semi-conductor member through relatively thin tongue-like inner feed lines made from a different metal than the metal of the carrier. The inner feed lines are made from a metal that can readily be connected with the electrodes of the semi-conductor, such as nickel. The thin feed lines extend from the outer support and connection legs and are made from a different metal that can readily be soldered, such as brass and have conductive contact with said legs. The inner feed lines and carrier are made by an etching process. The inner feed lines supporting the semi-conductor are resilient, and by their resiliency balance thermal expansion between the semi-conductor substrate and the coarse structure of the connection legs of the system carrier.

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Munich, Germany

Gerhard Mitterhummer