Siemens Aktiengesellschaft

Infineon Technologies Ag

Osram Gmbh

Siemens Energy Global Gmbh & Co. Kg

Osram Gesellschaft MIT Beschrankter Haftung

Gerhard Mitic

Karl Weidner

Randolf Mock

Stefan Stegmeier

Daniel Schmitt

Thomas Licht

Roland Huettinger

Wolfgang Pabst

Frank Schremmer

Eckhard Wolfgang

Martin Honsberg-Riedl

Philipp Erhard

Jürgen Stephan

Andreas Lindemann

Martin Honsberg

Robert Baumgartner

Benjamin Sahan

Thomas Vontz

Stefan Kiefl

Ulrich Henger

Jimmy-Alexander Butron-Ccoa

Siegfried Ramminger

Hans-Peter Degischer

Jakob Löschke

Jimmy Alexander Butron-Ccoa

To facilitate a reliable detection of age-related damage or delamination on components the following is proposed: [i] within the scope of radiofrequency reflectometry, scanning a component by radiofrequency signal irradiation in the micrometer or millimeter wavelength range and by measuring at least one reflection signal, which was reflected at the component, in punctiform, one-dimensional or two-dimensional fashion for the purposes of generating at least one first radiofrequency image representation; [ii] scanning the component in direct time offset fashion with respect to the radiofrequency signal irradiation by a combination of ultrasonic signal irradiation and the radiofrequency signal irradiation in the micrometer or millimeter wavelength range and by measuring at least one further reflection signal, which was reflected at the component; and [iii] comparing the radiofrequency image representations generated based on the reflection signals, wherein determined changes in the radiofrequency image representations indicate damage or delamination on the component.

Method and apparatus for detecting aging-dictated damage or delamination on components, in particular power modules of power electronic devices, and power electronic device, in particular converter

The present disclosure relates to power semiconductor modules. The teachings thereof may be embodied in modules with a power semiconductor component and methods, as well as a circuit arrangement. For example, a method may include: developing a thermal model of the power semiconductor module at a reference time point; establishing a reference temperature based on the thermal model; measuring a temperature-sensitive electrical parameter of the power semiconductor module during operation of the power semiconductor module; determining a current temperature from the measured temperature-sensitive electrical parameter of the power semiconductor module; calculating a temperature difference between the current temperature and the reference temperature; and determining a deterioration of the power semiconductor module based on the calculated temperature difference.

Method for determining a deterioration of power semiconductor modules as well as a device and circuit arrangement

A lighting device () comprising at least one light source (), at least one base () thermally and electrically operationally connected to the light source (), and at least one bulb fitting () provided for receiving the base (). The base () has at least one first heat transfer surface () and the bulb fitting () has at least one second heat transfer surface () in contact with the first heat transfer surface () either directly or by way of a foil (). At least one device () is provided for exerting a predefined press force between the first heat transfer surface () and the second heat transfer surface ().

Lighting device having a socket and bulb fitting

A composite material and a base plate made of this composite material for mounting electrical components and for connecting these components to a cooling device is disclosed. In one embodiment, the composite material includes a matrix material and fibers embedded therein. The fibers have in this case an anisotropic, directionally optimized distribution in the matrix material, so that heat occurring in a locally confined area can be effectively distributed and dissipated. The material of the fibers includes SiC, highly graphitized carbon or diamond. The fibers are arranged in the matrix material in various fiber levels, the fibers in the upper fiber levels being oriented predominantly horizontally in relation to a reference area and the fibers in the lower fiber levels being oriented predominantly vertically in relation to the reference area.

Composite material and base plate

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Munich, Germany

Gerhard Mitic