International Business Machines Corporation

Gerhard Meyer

Reto R Schlittler

Hanspeter Ott

Leo Gross

Bruno Schuler

Percy Zahl

Wolfram Steurer

Jascha Repp

A method for determining a value of a local contact potential difference by noncontact atomic force microscopy. For one or more cantilever positions above a surface of a sample: i) determining two distinct voltage values of DC voltage applied between an oscillating cantilever and the sample, and ii) determining, by one or more processors, a value of a local contact potential difference based, at least in part, on the two distinct voltage values that were determined.

Determination of local contact potential difference by noncontact atomic force microscopy

A method for determining a value of a local contact potential difference by noncontact atomic force microscopy. For one or more cantilever positions above a surface of a sample: i) performing two atomic force microscopy measurements, using an oscillating cantilever, ii) thereby determining two distinct voltage values of DC voltage applied between the cantilever and the sample, and iii) obtaining a value of a local contact potential difference based, at least in part, on the two distinct voltage values determined. Wherein substantially similar distinct values indicate a substantially similar value of frequency shifts of cantilever oscillation, as measured for each of said distinct values.

The invention provides methods and apparatus for defining a pattern on a substrate. An example apparatus includes: an emission source for directing an emission to the substrate, defining a working position between the emission source and the substrate, at least one shadow mask having one or more apertures and at least one inspection device for inspecting the properties of the substrate and/or the pattern, the inspection device having at least one inspection tool. The shadow mask and the inspection tool are separately provided on a movable portion, so that the shadow mask and the inspection tool are subsequently movable into the working position. The invention is further related to a method for defining a pattern on a substrate.

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Wollerau, Switzerland

Gerhard Meyer