Infineon Technologies Ag

Osram Opto Semiconductors Gmbh

Siemens Aktiengesellschaft

Osram Gmbh

Osram Opto Semiconductor Gmbh

Osram Oled Gmbh

Gerhard Kuhn

Hans-Ludwig Althaus

Ales Markytan

Markus Wicke

Peter Brick

Julius Muschaweck

Stephan Kaiser

Christian Neugirg

Alfred Hartl

Wolfgang Gramann

Christian Gaertner

Michael Sailer

Joachim Frank

Alfred Rast

Georg Bogner

Franz Auracher

Bernd Waidhas

Stefan Grötsch

Marten Swart

Moritz Engl

Ulrich Streppel

Josef Dirmeyer

Mario Wanninger

Joachim Reill

Uli Hiller

Albert Auburger

Martin Weigert

Hans Hurt

Patrick Kromotis

Vi-En Choong

Bruno Acklin

Joachim Schulze

Klaus Panzer

Julius Wittmann

Rudolf Keil

Hans Ludwig Althaus

Christian Gärtner

Günter Kirchberger

Nadir Farchtchian

Horst Varga

Dmytro Poplavskyy

Robert Seidl

Joachim Krug

Karl-Hans Reiss

Erwin Postmann

Monika Rose

Josef Hüttner

Andreas Stich

Manfred Scheubeck

Hubert Schmid

Wilhelm Karsten

Peter Gattinger

Sven Weber-Rabsilber

Karl Ubler

Feng Sheng

Chin Khew Leong

Vincent Wu

Frank Sheng

Aileen Chen

Ken Kuo

Kar Phooi Foong

A surface light guide includes a radiation exit area running along a main extension plane of the surface light guide and includes a light guiding region, which has scattering locations and a coating arranged on a first main area of the light guiding region, wherein radiation coupled in along the main extension plane impinging on the first main area after scattering at the scattering locations has an excessively increased radiation component and the coating reduces in a targeted manner an exit of the excessively increased radiation component from the radiation exit area.

Surface light guide and planar emitter

A lighting device may include: a rod-shaped carrier body with at least one first and one second mounting side and a main direction of extent, first semiconductor light-emitting elements on first mounting faces of the first mounting side, and second semiconductor light-emitting elements on second mounting faces of the second mounting side, wherein the first and the second mounting sides face away from one another, wherein the mounting faces are formed by depressions in the mounting sides, which depressions are arranged so as to be spaced apart along the main direction of extent, and wherein the first semiconductor light-emitting elements are identical to one another and the second semiconductor light-emitting elements are identical to one another.

Lighting device

A mixed light source has a first semiconductor component, which is provided for generating a first radiation fraction, and a second semiconductor component, which is provided for generating radiation of a second radiation fraction different from the first radiation fraction. The first semiconductor component is mounted by a first mounting point on a first heat sink with a first thermal resistance R. The second semiconductor component is mounted by a second mounting point on a second heat sink with a second thermal resistance R. The thermal resistances Rand Rare different from one another.

Mixed light source

The invention relates to a surface light source with a lighting surface that includes at least one semiconductor body that emits electromagnetic radiation from its front side during operation. Decoupling structures are suitable for producing a local variation of the light density on the lighting surface, so that the light density is increased in at least one illumination area with respect to a background area.

Surface light source

An optoelectronic semiconductor component, includes at least two optoelectronic semiconductor chips, which are located on a common mounting surface. An optical element is arranged downstream of the semiconductor chips in a main emission direction and is spaced from the semiconductor chips. In a direction transverse to the main emission direction the optical element has a transmission gradient in a transitional region. The transitional region does not overlap the semiconductor chips, when viewed in plan view onto the mounting surface.

Optoelectronic semiconductor component

A surface light guide has a radiation exit area extending along a main extension plane of the surface light guide and is provided for laterally coupling radiation. The surface light guide includes scattering locations for scattering the coupled radiation. The surface light guide includes a first boundary surface and a second boundary surface which delimit the light conductance of the coupled-in radiation in the vertical direction. A first layer and a second layer are formed on each other in the vertical direction between the first boundary surface and the second boundary surface. Further disclosed are a planar emitter including at least one surface light guide.

A light-emitting diode array is disclosed which has two light-emitting diodes which are connected in antiparallel with one another, and a power supply which is suitable for energizing the light-emitting diodes independently of one another in the forward direction. In addition, an optical recording apparatus and a method for the pulsed operation of a light-emitting diode are disclosed.

Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode

A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size Aand a maximum acceptance angle &#x3b1; for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle &#x3b2;. At least one of the LED chips has a radiation decoupling area of the size A. The relation 0.7&#xb7;(A&#xb7;sin(&#x3b1;))/(A&#xb7;sin(&#x3b2;)&#xb7;n)&#x2266;N&#x2266;1.3&#xb7;(A&#xb7;sin(&#x3b1;))/(A&#xb7;sin(&#x3b2;)&#xb7;n) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.

Projection apparatus

The invention relates to a method and device for determining the output power of a semiconductor laser diode being operated with a diode current. A defined measuring current, which is less than the threshold current of the semiconductor laser diode, is conducted in a conducting direction through the semiconductor laser diode. The forward voltage drop across the semiconductor laser diode is measured, and the temperature of the laser-active region of the semiconductor laser diode is determined from the measured forward voltage by using at least one calibration curve. The invention makes a simple and precise determination of the output power possible without requiring an additional measuring device, for example, a monitor diode.

Method and device for determining the output power of a semiconductor laser diode

The invention relates to an optoelectronic component with a light emitting or light receiving element ( ) and a system carrier ( ) supporting the element ( ). The element ( ) emits or receives light on a light transmitting surface ( ), an auxiliary carrier ( ) made of heat conductive material and transparent at least in some areas or at least translucent being provided. Said auxiliary carrier ( ) is connected to the system carrier ( ) and is thermally coupled to the element ( ). The invention also relates to a method for the production of such an optoelectronic component.

Optoelectronic component with thermally conductive auxiliary carrier

An electro-optical module includes a connector and a module body having an electro-optical converter. The connector accommodates one end of a fiber optic waveguide segment and aligns it with the optical connector interface at the side of the module body. The connector interface is provided at the top side of the module body.

Electro-optical module

The transceiver module has the transmitter and receiver mounted on one side of a leadframe above light passage openings formed therein. A beam deflection receptacle, containing a fiber connection opening, at least one beam splitter and a deflection mirror, is fixed on the other side of the lead frame. The external electrical terminals of the leadframe are bent around a plastic covering and shaped out to form terminal areas, so that the module is suitable for SMT.

Leadframe-based optoelectronic bidirectional transmitting and receiving module

An optical bidirectional transceiver module includes a module body having an opening, an inner hollow space and a fiber pin pushed through the opening into the inner hollow space. The fiber pin has a centric bored hole in which a light-conducting fiber is guided. A wavelength-selective filter or a beam splitter is located at a beveled end surface of the fiber pin. Radiation from an externally coupled light waveguide is emitted through the light-conducting fiber and reflected at the filter to a first optoelectronic component (transmitter). Received light radiation passes through the filter and impinges on a second optoelectronic component (receiver).

Optical bidirectional transceiver module having a pin element with integrated WDM filter

An optical device includes a surface-mountable optical component with a base member having a recess filled with a transparent filler and a VCSEL element arranged in the recess. A receptacle is attached to the surface-mountable optical component. The receptacle is for receiving an optical fiber to optically connect the VCSEL element to the optical fiber. Accordingly, an inexpensive way of coupling a VCSEL element with an optical fiber is provided. In particular, the surface-mountable component can be produced using a high volume production so that the overall costs of the optical device are reduced, even if the receptacle is produced in lower numbers due to varying requirements in the way that the VCSEL will be coupled to an optical fiber.

Optical device

An optoelectronic module is disclosed, which can be connected optically and electrically in a simply way. The optoeletronic module consists of a SMD-housing ( ) for the electrical connection and a connector ( ), on which a MT-plug is fitted, for the optical connection. The SMD-housing is assigned to the MT-plug. It includes a plug connector ( ), which contains the optical/electrical interface and is positively fixed in the housing.

Optoelectronic surface-mountable module and optoelectronic coupling unit

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Köfering, Germany

Gerhard Kuhn