Infineon Technologies Ag

Intel Corporation

Gerhard Knoblinger

Thorsten Meyer

Andreas Wolter

Harald Gossner

Thomas Schulz

Christian Cornelius Russ

Franz Kuttner

Stephan Leuschner

Michael Fulde

Daniel Sira

Klaus Von Arnim

Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.

Vertical inductor for WLCSP

A digital-to-analog converter circuit including a plurality of digital-to-analog converter cells is provided. A first digital-to-analog converter cell of the plurality of digital-to-analog converter cells includes a cell control module configured to provide alternatingly a first voltage and a second voltage to a first electrode of a capacitive element of the first digital-to-analog converter cell based on a digital input signal during a predefined time interval. A second digital-to-analog converter cell of the plurality of digital-to-analog converter cells includes a cell control module configured to provide a third voltage to a first electrode of a capacitive element of the second digital-to-analog converter cell during the predefined time interval. The first voltage is higher than an upper threshold voltage corresponding to a first digital threshold level of the digital input signal and the second voltage is lower than a lower threshold voltage corresponding to a second digital threshold level of the digital input signal. The third voltage is constantly between the upper threshold voltage and the lower threshold voltage.

Digital-to-analog converter circuit, an apparatus for providing a radio frequency transmit signal and a method of digital-to-analog conversion

An integrated circuit is disclosed. In one embodiment, the integrated circuit includes a first area and a second area. The first area is stress engineered to provide enhanced mobility in a first channel that has a first width. The second area is stress engineered to provide enhanced mobility in a second channel that has a second width. The first channel and the second channel provide a combined current that is greater than a single current provided via a single channel having a single width that is substantially equal to the sum of the first width and the second width.

Integrated circuit including a first channel and a second channel

An electronic circuit on a semiconductor substrate having isolated multiple field effect transistor circuit blocks is disclosed. In some embodiment, an apparatus includes a substrate, a first semiconductor circuit formed above the substrate, a second semiconductor circuit formed above the substrate, and a MuGFET device overlying the substrate and electrically coupled to the first semiconductor circuit and the second semiconductor circuit, wherein the MuGFET device provides a signal path between the first semiconductor circuit and the second semiconductor circuit in response to an input signal.

MuGFET switch

In a method for producing a thyristor, first and second connection regions are formed on or above a substrate; the first connection region is doped with dopant atoms of a first conductivity type and the second connection region is doped with dopant atoms of a second conductivity type; first and second body regions are formed between the connection regions, wherein the first body region is formed between the first connection region and second body region, and the second body region is formed between the first body region and second connection region; the first body region is doped with dopant atoms of the second conductivity type and the second body region is doped with dopant atoms of the first conductivity type, wherein the dopant atoms are in each case introduced into the respective body region using a Vt implantation method; a gate region is formed on or above the body regions.

Method for producing a thyristor

An electronic circuit on a semiconductor substrate having isolated multiple gate field effect transistor circuit blocks is disclosed. In some embodiments, an electronic circuit has a substrate having a buried oxide insulating region. A MuGFET device may be formed above the buried oxide region and coupled to a first source of reference potential. A semiconductor device may be formed above the substrate and coupled to a second source of reference potential. A coupling network may be formed to couple the MuGFET device to the semiconductor device.

Isolated multigate FET circuit blocks with different ground potentials

In a method for producing an electronic component, a first doped connection region and a second doped connection region are formed on or above a substrate; a body region is formed between the first doped connection region and the second doped connection region; at least two gate regions separate from one another are formed on or above the body region; at least one partial region of the body region is doped by means of introducing dopant atoms, wherein the dopant atoms are introduced into the at least one partial region of the body region through at least one intermediate region formed between the at least two separate gate regions.

In an embodiment, an apparatus includes a MuGFET device coupled to a reference source, the MuGFET device configured to receive an input signal at a gate thereof; and Also includes a further MuGFET device coupled between the MuGFET device and a first terminal of a load, a second terminal of the load coupled to a further reference source, the further MuGFET device configured to receive a further input signal at a gate thereof, and wherein the MuGFET device and the further MuGFET device are disposed above a substrate and configured to provide an output signal at the first terminal of the load.

MuGFET circuit for increasing output resistance

Method for producing multi-gate field-effect transistor with fin structure having drain-extended MOS field-effect transistor

A semiconductor circuit arrangement includes at least one first and a second field effect transistor, where the field effect respectively have at least two active regions with, respectively, a source region, a drain region and an intermediate channel region, the surface of the channel regions having a gate formed on it, insulated by a gate dielectric, for actuating the channeel regions. At least one active region of the second field effect transistor is arranged between the at least two active regions of the first field effect transistor, which results in a reduced mismatch between the two transistors, caused by temperature and local distances.

Growing community of inventors

Villach, Austria

Gerhard Knoblinger