Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Friedrich-schiller-universitat Jena

Leica Microsystems Lithography Gmbh

Friedrich-schiller-universtaet Jena

Gerhard Kalkowski

Ramona Eberhardt

Christoph Damm

Thomas Peschel

Andreas Tuennermann

Andreas Tünnermann

Stefan Risse

Volker Guyenot

Ulf-Carsten Kirschstein

Gerd Harnisch

Stefan Nolte

Gerhard Schubert

Simone Fabian

Olaf Stenzel

Wieland Stöckl

Carolin Rothhardt

Mathias Rohde

Charlotte Jahnke

Mark Schuermann

Stefan Dipl-Ing Risse

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100&#xb0; C. and at under pressure conditions of a maximum of 10 mbar, preferably &#x3c;10mbar.

Method for joining substrates

The invention relates to a method of producing lightweight structural elements which are produced as a composition construction element having at least one cover plate and one carrier element which are connected to one another. A carrier element, at which at least one apertures and/or at least one cut-out is/are formed and at least one further element, which is a cover plate, are connected to one another. A carrier element and at least one cover plate can be formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another. The carrier element should have at least a double thickness with respect to the thickness of a cover plate. The surfaces of the cover plate(s) and of the carrier element to be connected to one another should be intensely cleaned in their bonding regions and should be smoothed such that a roughness of the surface is achieved there, such that they are in direct touching contact with at least 80% of their bonding surface with an active compression source and in this respect a thermal treatment is carried out at a temperature of at least 100&#xb0; C. and maintaining of the temperature over a period of at least 0.5 h to establish a bond connection of the cover plate(s) and the carrier element. In this respect, at least one cover plate should be connected to a surface of the carrier element at which at least one opening of an aperture or of a cut-out is arranged.

Method of producing lightweight structural elements

The present invention pertains to a process for the silicate bonding of joined surfaces, facing one another, of two components by means of an aqueous, alkaline, silicon-cation-containing joining solution for the purpose of producing an optical element, characterized in that one or both of said joined surfaces () are covered with a layer of an oxide (), which has a higher refractive index than SiOand is selected from among oxides of the third and fourth main group elements, of the second and third group of the transition elements as well as zirconium and from among mixed oxides of the said elements, whereupon the joining solution is applied to at least one of the surfaces to be joined and the surfaces are bonded to one another. The present invention also teaches the use of oxide layer () as a topmost layer of a component to be joined by means of an alkaline, silicate-containing solution for preventing or reducing opacifications and/or defects as a result of a chemical attack on the layer lying under it by the said alkaline solution.

Method for the siliceous bonding of coated and uncoated optical bodies

The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.

Method for laser-assisted bonding, substrates bonded in this manner and use thereof

Flexibly deformable holding elements operate such that substrates can be held in a fixed manner at a surface of the holding element electrostatically or also by use of negative pressure and planar positional deviations or unwanted deformations can be compensated simply and reliably, where at least one cut-out having an opening arranged at the rear side is formed at the rear side of the holding element which is disposed opposite the surface, and an actuator is arranged there exerting compressive forces or pulling forces for a widening or narrowing of the cut-out and/or for a deformation of the holding element.

Flexibly deformable holding element for substrates

The embodiments disclosed herein relate to an electrostatic chuck, or an optically structured element or an optical mask that comprise a metal film as well as a transparent cover applied on a substrate. At least two anti-reflective films are inserted between the metal film and the cover that reduce the reflectance of the metal film, as viewed from the surface, to almost zero. As a result, a direct interferometer measurement of the surface structure of the transparent cover is possible. Methods of measurement and of use are also disclosed.

Electrostatic chuck with anti-reflective coating, measuring method and use of said chuck

The present invention provides for a device for holding a substrate in an exposure system. In the exposure system, the substrate is positioned on a table movable in the X and Y coordinates of an X, Y plane, and the exposure system provides a metering assembly between a table surface and the substrate to adjust the distance and to align the substrate in relation to an exposure optics, from where a corpuscular radiation is directed right-angled onto a substrate surface, corresponding to the Z coordinate. The device for holding the substrate includes two mounting plates aligned parallel to the X, Y plane, adjusted upon the table in a direction to the exposure optics and with different distances to the table surface, the first mounting plate of which being directly connected to the table. The second mounting plate is connected with the first mounting plate through at least one holding device, and has a bearing plane for the substrate being designed on that side of the second mounting plate turned to the exposure optics.

Holding device for a substrate

Growing community of inventors

Jena, Germany

Gerhard Kalkowski