Osram Gmbh

Infineon Technologies Ag

Gerhard Holzapfel

Peter Sachsenweger

Ralph Bertram

Tobias Frost

Steffen Strauss

Martin Reiss

Raimund Schindler

An LED module may include at least one passage opening from a first side of the LED module to a mounting side of the LED module, located opposite the first side. The passage opening is formed in such a way that a screw for fixing the LED module to a mounting element can be inserted into the passage opening from the first side to the mounting side of the LED module, and with a film which, at least in part, is arranged in an adhesive manner on the first side of the LED module. The film has at least one structure which includes at least one piercing of the film in the area of the at least one passage opening of the LED module.

LED module with protective film

A lighting device may include at least one semiconductor light source cast with at least one first casting compound, wherein at least one region of the lighting device has: at least one connection area, which is electrically connected to the at least one semiconductor light source, and at least one electrical connecting element, which has at least one electrical line, wherein at least one electrical line is connected to an associated connection area and protrudes at one end out of the lighting device, and the at least one connection area and the at least one electrical connecting element are arranged in a cutout in the first casting compound and are cast by means of a second casting compound.

Lighting device and method for producing a lighting device

A semiconductor chip assembly system has a suction nipple for picking up a semiconductor chip from a carrier film. For this purpose, the suction nipple has a dimensionally stable cylindrical mouthpiece with a suction bore. The mouthpiece is adjoined by a rubber-elastic region of the suction nipple and goes over into a dimensionally stable suction tube attachment of the suction nipple.

Semiconductor chip assembly system with a suction nipple for removing a semiconductor chip

Growing community of inventors

Rain, Germany

Gerhard Holzapfel