At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Gerhard Freydl

Markus Leitgeb

Johannes Stahr

Andreas Zluc

Christian Vockenberger

Mike Morianz

Wolfgang Schrittwieser

Nikolai Haslebner

Günther Weichslberger

Christoph Thumser

Arno Kriechbaum

Fritz Haring

Andrea Koertvelyessy

Mark Beesley

A component carrier includes a stack with electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures have a higher density connection region and a lower density connection region, and a first component and a second component which are surface-mounted on the stack. The first component and the second component are electrically coupled with each other by the higher density connection region.

Component carrier with surface mounted components connected by high density connection region

An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.

Interposer-type component carrier and method of manufacturing the same

In a method for processing a plurality of printed circuit boards, comprising the following steps:

Method and composite assembly for processing or treating a plurality of printed circuit boards and use therefor

The invention relates to a method for connecting a plurality of elements for a circuit board, comprising the following steps: Furthermore, a circuit board produced from a plurality of elements connected to each other is provided.

Method for connecting a plurality of elements of a circuit board

This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component () is embedded inside an insulating-material layer () and contacts () are made to connect the component () electrically to the conductor structures () contained in the electronic module. According to the invention, at least one thermal via (), which boosts the conducting of heat away from the component () is manufactured in the insulating-material layer () in the vicinity of the component ().

Method for integrating an electronic component into a printed circuit board

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Leoben, Austria

Gerhard Freydl