Bayer Aktiengesellschaft

Miles Inc.

Gerhard-Dieter Wolf

Friedrich Jonas

Ulrich Von Gizycki

Gunther Reichert

Rudolf Merten

Kirkor Sirinyan

Wilfried Haese

Gert Jabs

Henning Giesecke

Wolfgang Cohnen

Reinhard Schomacker

Frank Kobelka

Reinhold Dederichs

John L Williams

Rigid or flexible circuits of electrically conductor tracks can be produced on flexible or rigid, non-conductive support materials by

Process for producing rigid and flexible circuits

Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a microemulsion of a monomeric thiophene of the formula (I) is used to form the conductive polythiophene layer, ##STR1## in which X denotes oxygen or a single bond,

Process for through-hole plating of two-layer printed circuit boards and

Electrolessly deposited metal films having improved adhesion can be obtained by coating the surface of the substrates to be metallized with a formulation consisting of UV-curable varnishes which contain noble metal compounds as activators and, in addition, either fillers or solvents or a combination of fillers and solvents, curing these varnishes by means of UV radiation, followed by electroless metallization of the substrates thus treated.

Process for improving the adhesiveness of electrolessly deposited metal

A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.

Process for through-hole plating of two-layer circuit boards and

Formulations which contain a water-dispersible polymer, a metallization catalyst, if appropriate fillers, if appropriate other constituents and water are outstandingly suitable for the pretreatment of various substrate surfaces for the purpose of subsequent metallization in a currentless metallization bath.

Hydroprimer for metallising substrate surfaces

Formulations containing an organometallic activator, a filler, a solvent and an aqueous dispersion of a polyurethane polymer are outstandingly suitable for activation of surfaces of plastics for currentless metallisation thereof. The components of plastic activated in this way are preferably employed, after metallisation has been carried out, for shielding from electromagnetic waves.

Formulation for the activation of substrate surfaces for currentless

An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation. The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.

Growing community of inventors

Dormagen, Germany

Gerhard-Dieter Wolf