Bayer Aktiengesellschaft

Other

Gerhard D Wolf

Henning Giesecke

Rudolf Merten

Kirkor Sirinyan

Francis Bentz

Ulrich Von Gizycki

Harold Ebneth

Hans E Kunzel

Gunther Nischk

Ralf Miessen

Klaus Elfert

Friedrich Jonas

Uwe Claussen

Hans J Rosenkranz

Lothar Preis

Helmut Engelhard

Robert Bierling

Hanns P Muller

Wolfgang Hoelderich

Ulrich Reinehr

Joachim Probst

Bruno Bomer

Wilfried Zecher

Hermann Perrey

Joachim Wank

Wolfgang Henning

Karlheinz Hildenbrand

Dirk Cyriel Quintens

Hans G Fitzky

Michael Gates Kinnaird

Klaus Schuster

Gunther Reichert

Peter Kleinschmidt

Siegfried Petersen

Martin Wienkenhover

Louis Bollens

Bruce Benda

Hans-Egon Kunzel

Dieter Steinhoff

Werner Schnoor

Jean-Claude Voegele

Friedrich Langer

Reinhart Matejek

Jochen Voss

Jochen Houben

Ulrich V Gizycki

Andre Heyvaerts

Gunther Blankenstein

A shaped plastic part and a flexible film with a protected conductor track, in particular made from copper, are described, as is a process for their production. The shaped plastic part or the flexible film is composed at least of a plastic film ( ) as backing layer, and of a metalizable primer layer ( ) applied thereto, and of a structured, metallic electrically conducting layer ( ), in particular electrical conductor tracks, applied to the primer layer ( ), where an additional outer film ( ) or a plastic article ( ) has been firmly connected to the composite made from backing layer ( ), primer layer ( ) and from conducting layer ( ) in such a way that the outer film ( ) or the plastic article ( ) covers at least part of the conducting layer ( ).

Moulded part and flexible film with a protected printed conductor, and method for producing the same

A metal-coated film can be produced continuously from a non-conducting film by successive electroless and galvanic metallization in such a way that a film of this kind is subjected, in a continuous 'roll-to-roll' process, to the following operations:

Process for producing metal-coated films in web form

Primers, essentially consisting of a film former or matrix former, an additive, an ionic and/or colloidal noble metal, a filler and a solvent, are suitable for coating substrate surfaces for subsequent chemical metallization.

Primer for the metallization of substrate surfaces

Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.

Method of making injection-moulded printed circuit boards

Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization. The metal coatings produced are distinguished by good adhesion.

Process for improving the adherency of metallic coatings deposited

Formulations containing an organometallic activator, a filler, a special mixture of organic solvents and a PU elastomer are eminently suitable for activating plastic surfaces for their electroless metallization avoiding stress-corrosion cracking. The plastic parts so activated are preferably used for screening from electromagnetic waves after metallization has been carried out.

Formulation of activating substrate surfaces for their electroless

Alkoxylates of active hydrogen compounds having a peaked molecular weight distribution are prepared by reacting the active hydrogen compound with an alkylene oxide of from 2 to 4 carbon atoms using iron oxides as alkoxylation catalysts.

Alkoxylation of active hydrogen compounds

Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.

Process for producing electrical conductor boards

To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.

Process for improving the adhesive strength of electrolessly deposited

Flexible circuits are obtained in an elegant manner, without the customary etching methods, wet-chemically in accordance with the principles of semiadditive or fully additive technology by using for the activation noble metal activators and, as base material, films or flexible boards whose surface has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3/ m.sup.2, (b) an average pore diameter of 0.05-5.0 .mu.m and (c) an average pore depth of 0.05-4.0 .mu.m.

Flexible circuits

Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization. The metal deposits produced are notable for good bond strength.

Method of improving the bond strength of electrolessly deposited metal

An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

Process for the production of printed circuit boards

Polymer membranes metallized by wet chemistry are highly suitable, for example, for the separation of inert, reactive and fermentation gases. The metallization is carried out after activation with noble-metal complex compounds which have at least two functional groups. Preferred metal coatings are those of Cu, Co and Ni.

Metallized membrane systems

A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.

Process for activating substrate surfaces for electroless metallization

A process suitable for the fully additive technique for the electroless partial metallization of substrate surfaces consists in treating the surface with photosensitive silver(I) compounds (e.g. carboxylic acid salts), partially exposing the silver(I) compounds left behind on the surfaces, if necessary intensifying the exposure effect and/or exchanging the silver produced during the exposure for nobler metals, and detaching the unexposed silver(I) compounds.

Process for the partial metallization of substrate surfaces

Growing community of inventors

Dormagen, Germany

Gerhard D Wolf