Atotech Deutschland Gmbh

Gerd Senge

Wolfgang Dahms

Gonzalo Urrutia Desmaison

Stefan Kretschmer

Michael Jonat

Torsten Küssner

Thorsten Ross

Detley Nitsche

In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.

Copper bath and methods of depositing a matt copper coating

For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper ions, at least one compound increasing the electrical conductivity of the deposition bath as well as at least one additive, at least one transformation product, formed from epihalohydrins, dihalohydrins or respectively 1-halogen-2,3-propanediols and polyamidoamines being contained as the additive. The polyamidoamines are formed by the condensation reaction of dicarboxylic acids with polyalkylene polyamines. When copper coatings are deposited from this bath, copper layers of uniform layer thickness can be deposited.

Water bath and method for electrolytic deposition of copper coatings

Process for the electrolytic deposition of copper layers

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Berlin, Germany

Gerd Senge