Rohde and Schwarz Gmbh & Co. Kg

Gerd Hechtfischer

Christian Evers

Adam Tankielun

Werner Perndl

Ralf Jünemann

Christian Pinta

Wolfgang Cohrs

Sherif Sayed Ahmed

Martin Leibfritz

Markus Gallhauser

Michael Katzer

Nino Voss

Andreas Schiessl

Ralf Juenemann

Wilhelm Hohenester

Thomas Will

Martin Hassler

Rupert Huber

Mathias Nagel

Andrea Deutinger

Achim Walber

Monika Völk

René Krupka

Jan Prochnow

Juergen Thies

Ralf JÜNEMANN

Monika VÖLK

An over the air measurement module comprises an antenna, adapted to receive a first measuring signal from a device under test or to transmit a second measuring signal to the device under test. It also comprises an analog signal processor, directly connected to said antenna, adapted to reduce a frequency of the received first measuring signal, resulting in a frequency reduced first measuring signal, or adapted to increase a frequency of a frequency reduced second measuring signal, resulting in the second measuring signal. It also has a connector connected to said analog signal processor and is adapted to output the first frequency reduced measuring signal or is adapted to receive the second frequency reduced measuring signal.

Over the air measurement module

A measuring system for measuring a high frequency signal is provided. The measuring system comprises an antenna module, adapted for receiving the high frequency signal. Moreover, the system comprises a detector module adapted for deriving a measuring signal from the high frequency signal. Finally, the system comprises a sensor module adapted for measuring the measuring signal. The sensor module is arranged in a housing, while the detector module is not arranged in the housing. The detector module is connected to the sensor module by a first cable, which is adapted to transmit the measuring signal from the detector module to the sensor module.

Measuring system for over-the-air power measurements

A substrate-based circuit () provides a carrier substrate (), wherein a bond layer () is embodied on at least one part of the carrier substrate (), and wherein a contact layer () which forms at least one conductor line () and/or at least one antenna element () is embodied on at least one first part () of the bond layer (). The carrier substrate () provides at least one fastening element (), which is deposited at the outer region of the carrier substrate () and projects beyond the outer region of the carrier substrate ().

Circuit on a thin carrier for use in hollow conductors and a manufacturing method

A calibration unit for a measurement device for connecting to a connector embodied in a coaxial manner. The calibration unit provides a housing and an inner conductor, whereas the inner conductor () is embodied centered within an aperture of the housing. The calibration unit provides a connecting element, that the connecting element is inserted into the aperture of the housing and hosts the inner conductor and that the connecting element is embodied in an elastic manner and supports the inner conductor in an elastic manner relative to the housing.

Calibration unit for a measurement device

A printed-circuit board arrangement electrically connects the at least one transmitter and/or receiver unit with at least one antenna element, whereas the at least one transmitter and/or receiver unit and the at least one antenna element are at least partially integrated into the printed-circuit board arrangement. In this context, the printed-circuit board arrangement includes different printed circuit boards, which are mechanically connected to one another in a rigid manner. A first part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a first material which is suitable for high-frequency, and a second part of the printed-circuit board arrangement is formed by at least one printed-circuit board, of which the substrate is made from a second material different from the first material, which is still sufficiently suitable for a low frequency and/or for a direct-voltage range.

Printed-circuit board arrangement for millimeter-wave scanners

A measuring device used for registering a test signal originating from a circuit structure applied to a wafer. The measuring device provides at least one test probe and at least one test transformer. The at least one test transformer is connected to the at least one test probe in an electrically conductive manner. In this context, the test transformer is arranged on the test probe.

Test probe with integrated test transformer

A device for the investigation of an object uses a microwave transmitter, a microwave receiver, a control device and a contrast medium. The microwave transmitter and the microwave receiver are controlled by the control device. In one embodiment, the following steps may be implemented:

Microwave investigation with a contrast medium

The directional coupler () in coplanar waveguide technology comprises at least one first directional coupler unit () with a first connection () for feeding in or guiding out a wave, a second connection () for feeding in or guiding out a wave supplied directly from or to the first connection (), a coupled connection () for coupling a fraction of a feeded wave at connection ()and a termination (). The first connection () is connected to the second connection () via a first center conductor (). The coupled connection () is connected to the termination () via a second center conductor (). The center conductors () are bordered on the outside by ground conductors (). The spacing between the center conductor () and its adjacent ground conductor () and/or between the center conductor () and its adjacent ground conductor () and the spacing between the two center conductors () as well as the width of the conductor track of the two center conductors () change along the longitudinal extension of the center conductors ().

Directional coupler in coplanar waveguide technology

A power detector for measuring the average power, without constant voltage, of modulated or unmodulated high frequency or microwave signals is described. The power detector includes a signal line connected to a high frequency input. A detection line is capacitively and/or inductively coupled to the signal line and, seen in the longitudinal direction, is connected to the signal line. The signal is tapped from the detection line at two or more detection positions which are staggered in the longitudinal direction.

Power detector with constant voltage decoupling

An electronic microwave circuit () with field effect transistors which are integrated on at least one semiconductor chip (), has a light source (), which radiates the field effect transistors with light and possesses a housing () which encloses in a microwave excluding manner the semiconductor chip () and the light source () or a light conducting means () connected with the light source ().

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Vaterstetten, Germany

Gerd Hechtfischer