Asml Netherlands B.v.

Gerardus Petrus Matthijs Van Nunen

Erik Roelof Loopstra

Sjoerd Nicolaas Lambertus Donders

Johannes Catharinus Hubertus Mulkens

Christiaan Alexander Hoogendam

Bob Streefkerk

Jeroen Johannes Sophia Maria Mertens

Johannes Jacobus Matheus Baselmans

Joeri Lof

Alexander Straaijer

Klaus Simon

Henrikus Herman Marie Cox

Jan-Gerard Cornelis Van Der Toorn

Antonius Theodorus Anna Maria Derksen

Frits Van Der Meulen

Bernardus Antonius Slaghekke

Martijn Houkes

Rene Theodorus Petrus Compen

Jozef Augustinus Maria Alberti

Frans Erik Groensmit

Marco Adrianus Peter Van Den Heuvel

Joost Jeroen Ottens

Levinus Pieter Bakker

Martijn Houben

Abraham Alexander Soethoudt

Martinus Agnes Willem Cuijpers

Robertus Nicodemus Jacobus Van Ballegoij

Pieter Johannes Gertrudis Meijers

In a lithographic apparatus, a localized area of the substrate surface under a projection system is immersed in liquid. The height of a liquid supply system above the surface of the substrate can be varied using actuators. A control system uses feedforward or feedback control with input of the surface height of the substrate to maintain the liquid supply system at a predetermined height above the surface of the substrate.

Lithographic apparatus and device manufacturing method

A calibration method for calibrating an optimum take over height of a substrate in a lithographic apparatus between a substrate table and an ejector element moveable to load and unload the substrate from the substrate table, the method including clamping the substrate on one of the substrate table and ejector element; moving the ejector element between an unloaded state wherein the substrate is supported by the substrate table and a loaded state wherein the substrate is at least partly supported by the ejector element; determining a reference height of the ejector element at the moment that the weight of the substrate is at least partly taken over between the substrate table and the ejector element; and determining the optimum take over height for the ejector element from the determined reference height.

Calibration method and lithographic apparatus for calibrating an optimum take over height of a substrate

A method of placing a substrate onto a surface of a substrate holder, in which the surface is provided with a plurality of burls. Substrate placement data for allowing placement of the substrate at a certain position with respect to a position of the plurality of burls on the surface of the substrate holder is calculated. The substrate is placed at the certain position in accordance with the substrate placement data. The certain position may be based on the position at which placement would result in a minimized overlay error or may be based on the position at which placement would result in minimized substrate deformation.

Method of placing a substrate, method of transferring a substrate, support system and lithographic projection apparatus

A method is provided for placing a substrate onto a surface of a substrate holder, the surface having a plurality of burls. First substrate placement data is calculated. This data enables placement of the substrate at a certain position with respect to a position of the plurality of burls on the surface of the substrate holder. Then, the substrate is placed at the certain position in accordance with the substrate placement data. The certain position may be based on the position at which placement would result in a minimized overlay error or may be based on the position at which placement would result in minimized substrate deformation.

A method is provided for transferring a substrate from a first substrate holder, e.g., a pre-alignment unit, to a second substrate holder, e.g., a substrate table in a lithographic apparatus, by means of a transfer unit on the basis of transfer data available thereto. First, the substrate is provided on the first substrate holder. Subsequently, a position error of the substrate is measured, and positioning adjustment data are calculated based on the position error as measured. Then, the second substrate holder is moved relative to a reference position thereof in accordance with the positioning adjustment data. Finally, the substrate is transferred by means of the transfer unit from the first substrate holder to the second substrate holder in accordance with the transfer data, and placed on the second substrate holder as moved.

Method of transferring a substrate, transfer system and lithographic projection apparatus

The invention relates to a method of transferring a substrate from a first substrate holder to a second substrate holder in a lithographic projection apparatus by using a transfer unit on the basis of transfer data available thereto. The second substrate holder has a surface provided with a first plurality of burls. In the method, a memory encoded with burl position data and substrate position data is provided. Subsequently, a substrate is provided on the first substrate holder. The position error and orientation of the substrate is then measured. On the basis of the burl position data, substrate position data and orientation as measured orientation adjustment data are calculated. The orientation of the substrate is subsequently adjusted in accordance with the orientation adjustment data. The substrate is then transferred from the first substrate holder to the second substrate holder by the transfer unit and placed on the second substrate holder.

A substrate holder has burls having a height not less than 100 &#x3bc;m and at least 10 vacuum ports arranged within a central region extending to a radius of two thirds the radius of the substrate. Thereby concave wafers can be reliably clamped by generating an initial vacuum in a central region which exerts a clamping force tending to flatten the wafer and allowing the initial vacuum to deepen until the wafer is fully clamped.

Lithographic apparatus, device manufacturing method and substrate holder

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Berghem, Netherlands

Gerardus Petrus Matthijs Van Nunen