Asml Netherlands B.v.

Gerardus Arnoldus Hendricus Franciscus Janssen

Engelbertus Antonius Fransiscus Van Der Pasch

Jan Steven Christiaan Westerlaken

Peter Paul Steijaert

Franciscus Van De Mast

Johannes Henricus Wilhelmus Jacobs

Antonius Johannus Van Der Net

Daniel Jozef Maria Direcks

Martijn Van Baren

Nicholas Peter Waterson

Joost André Klugkist

Sven Pekelder

Remco Van De Meerendonk

Jaap Oudes

Johannes Franciscus Martinus Van Santvoort

Jeroen Peterus Johannes Van Lipzig

Güneş Nakiboǧlu

A temperature conditioning system using conditioning liquid to condition a temperature of an object, the system including a conditioning conduit, a return conduit, a supply chamber, and a discharge chamber, wherein the temperature conditioning system is arranged to provide a static pressure difference between the supply chamber outlet and the discharge chamber inlet to create a flow through the conditioning conduit. A lithography apparatus and a method of temperature conditioning an object is also described.

Temperature conditioning system, a lithographic apparatus and a method of temperature conditioning an object

A lithographic apparatus having a first outlet to provide a thermally conditioned fluid with a first flow characteristic to at least part of a sensor beam path, and a second outlet associated with the first outlet and to provide a thermally conditioned fluid with a second flow characteristic, different to the first flow characteristic, adjacent the thermally conditioned fluid from the first outlet.

Lithographic apparatus and device manufacturing method

A substrate handling system includes: a thermal shield for thermally insulating a space through which a substrate passes, from a thermal load originating outside the space, the thermal shield including: a first wall and a second wall with a gap therebetween, the first wall positioned between the space and the second wall; an inlet opening configured to allow a flow of gas from a gas source to enter the gap from outside the space; and an outlet opening configured to allow the flow of gas to exit the gap to outside of the space, wherein the system is configured to direct the flow of gas to enter the gap through the inlet opening, to flow through the gap and out of the gap to outside the space through the outlet opening thereby to reduce thermal fluctuations in the space due to the thermal load originating outside the space.

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Eindhoven, Netherlands

Gerardus Arnoldus Hendricus Franciscus Janssen