Sabic Innovative Plastics IP B.v.

Sabic Global Technologies B.v.

Gerardo Rocha-Galicia

Hua Guo

Alvaro Carrillo

Christina Louise Braidwood

Michael Joseph O'Brien

Qiwei Lu

Prameela Susarla

Nitin Vilas Tople

Stephen M Farnell

Farah Jean-Jacques Toublan

Stephen Farnell

The invention is directed to a method for producing poly(arylene) ethers with improved particle size characteristics. The improved particle size characteristics of the polyphenylene ether include one or both of: (i) up to about 50 weight percent of particles smaller than 38 micrometers; and a (ii) mean particle size greater than 100 or more micrometers.

Process for formation of poly(arylene ethers) with lower fine particle content

A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Method of separating a poly(arylene ether) composition from a solvent, and poly(arylene ether) composition prepared thereby

A thermoplastic composition includes a poly(arylene ether) and a poly(arylene ether)-polysiloxane block copolymer. The thermoplastic composition is prepared by a method that includes oxidatively copolymerizing a monohydric phenol and a hydroxyaryl-terminated polysiloxane. The method is simpler than prior methods of preparing poly(arylene ether)-polysiloxane block copolymers by linking pre-formed poly(arylene ether) and polysiloxane blocks. The method is also produces greater incorporation of polysiloxane into the poly(arylene ether)-polysiloxane block copolymer than prior methods of copolymerizing monohydric phenols and hydroxyaryl-terminated polysiloxane.

Poly(arylene ether)-polysiloxane composition and method

A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.

Molding composition and method, and molded article

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Clifton Park, NY, United States of America

Gerardo Rocha-Galicia