Delphon Industries, LLC

Gel Pak L.l.c.

Gerardo Bagalawig Nazareno

Steven David Swendrowski

Joseph J Dlugokecki

Carmencita I Robbins

A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.

Method for reconstructing an integrated circuit package using lapping

A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.

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San Diego, CA, United States of America

Gerardo Bagalawig Nazareno