E.i. Dupont De Nemours and Company

Gerard O'Neil

Lynda Kaye Johnson

Reid John Chesterfield

Jeffrey Scott Meth

Graciela Beatriz Blanchet

Feng Gao

Geoffrey Nunes

Irina Malajovich

Roupen Leon Keusseyan

Richard Kevin Bailey

John W Catron, Jr

Rinaldo Soria Schiffino

Jonathan V Caspar

Nancy G Tassi

Dalen E Keys

Thomas C Felder

Gary Delmar Jaycox

Marc Bruce Goldfinger

Kenneth George Sharp

Hong Meng

Howard David Glicksman

Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom

Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Thin film transistor comprising novel conductor and dielectric compositions

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Newark, DE, United States of America

Gerard O'Neil