Valeo Electronique

Valeo Etudes Electroniques

Gerard-Marie Martin

Jean-Michel Morelle

Laurent Vivet

In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.

Laser soldering using thermal characteristics

The invention concerns an assembly supported on a base plate forming a radiator or capable of being directly mounted on the base plate, comprising a printed circuit card ( ) having its thickness a plurality of holes ( ) ensuring heat transfer between one face of said printed circuit card ( ), which bears one or several electronic components ( ) each enclosed by a box, and a base plate ( ). The base plate forms a radiator having a plurality of pads ( ) made of heat conducting material and which run through the printed circuit card ( ) over substantially its whole thickness to ensure heat transfer between a face of the printed circuit card ( ) and the base plate. The pads ( ) are integral with a sole plate ( ) which bears them. The sole plate ( ) is interposed between the printed circuit card ( ) and the base plate.

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Paris, France

Gerard-Marie Martin