Rakuten Symphony, Inc.

Gerard MacManus

A circuit board connection system is provided having a first circuit board having a first connector and a second circuit board having a second connector for mating with the first connector. A chassis is provided for mounting the first circuit board and the second circuit board, and when assembled, the first circuit board and the second circuit board lie parallel to a mounting surface of the chassis. At least one first alignment feature is fixed to or integrated into the first circuit board and at least one complementary alignment feature is fixed to or integrated into the second circuit board or the mounting surface of the chassis. An interaction between the first alignment feature and the complementary alignment feature forces alignment of the first connector with the second connector as the first circuit board is moved towards the second circuit board along the mounting surface of the chassis.

Right angled blind mate interconnection

Edge device

A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organized into at least two fin sections, wherein a first fin section has a first set of fins of the plurality of fins and a second fin section has a second set of fins of the plurality of fins. The chassis further provides a thermal break between the first fin section and the second fin section, the thermal break being an air gap between the first set of fins and the second set of fins. An aerofoil is then fixed in the air gap and inhibits air flow between the first fin section and the second fin section.

Heatsink chassis with aerofoil

A chassis is provided for supporting electronic device circuitry. The chassis generally includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The cooling surface has a plurality of heatsink fins extending from the cooling surface. The chassis also has at least one vapor chamber between the mounting surface and the cooling surface. The vapor chamber is located adjacent the plurality of heatsink fins.

Growing community of inventors

Surrey, United Kingdom

Gerard MacManus