Dynapert-htc Corp.

Gerard G Derrico

A soldering system for applying molten solder to a work product. The system includes a solder applicator having a cylindrical barrel having an elongated orifice wall extending parallel to the axis of the barrel and a nozzle secured to the barrel. The nozzle which has an elongated orifice surface can be from a first position whereat the orifice surface and the orifice wall define an elongated orifice having a selected opening to a second position whereat the opening is substantially enlarged.

Vapor phase processing machine

A vapor phase processing machine is disclosed. The machine has an open tank which is sealed by a lid assembly which is universally free to move within selected limits established between the lid assembly and the closure arm to which it is secured.

A machine for soldering a work product. Work product is conveyed through the machine and an applicator directs an extended liquid stream against the conveyed work product. The applicator is rotatable about a horizontal axis and a rotatable manifold assembly delivers liquid to the applicator and the manifold assembly is rotatable about an axis parallel to the axis of the applicator means and is rotated by a bell crank which is supported for rotation about the axis of the manifold assembly and a link member which is pivotally connected between the bell crank and the applicator with the points of interconnection defining with the axes of rotation of the applicator and the manifold assembly a parallelogram so that rotation of the bell crank will rotate the applicator means.

A machine for soldering a work product. A solder applicator is located within a zone of saturated vapor to direct an extended stream of molten solder against a work product conveyed through the machine. Molten solder can be drained from the applicator by pivoting the applicator about a horizontal axis to a drain orientation. The applicator includes an end plate having an axially extending hole communicating with the lowermost portion of the solder within the applicator when the applicator has the drain orientation and the applicator includes an end plate having a hole extending axially therethrough at a location in alignment with the applicator end plate hole when the applicator end plate has the drain orientation. The applicator end plate hole is sealed when the holes are not in alignment.

Vapor phase soldering machine

A vessel contains a volume of solder and a volume of electronic liquid floats on the solder. A heater heats the electronic liquid to generate a zone of saturated vapor and to transfer heat to the solder across the interface therebetween. Hot saturated vapor is drawn downwardly through a manifold in the solder. To heat the solder, means for conveying work product to the saturated vapor zone, and molten solder is applied to work product which is conveyed through the saturated vapor zone.

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Maynard, MA, United States of America

Gerard G Derrico