Infineon Technologies Ag

Infineon Technologies Austria Ag

Gerald Wriessnegger

Leo Aichriedler

Juergen Hoegerl

Christian Schweikert

Thomas Hafner

Tomas Manuel Reiter

Dietmar Spitzer

Christoph Koch

Michael Ortner

Andreas Schenk

Johannes Hackl

Volker Thorsten Schmidt

A semiconductor module includes a semiconductor die, a mold compound encasing the semiconductor die, a plurality of terminals electrically connected to the semiconductor die and protruding out of the mold compound, wherein a first one of the terminals has a constricted region covered by the mold compound, wherein the mold compound has a recess or an opening near the constricted region of the first terminal, and a coreless magnetic field sensor disposed in the recess or the opening of the mold compound and isolated from the first terminal by the mold compound. The coreless magnetic sensor is configured to generate a signal in response to a magnetic field produced by current flowing in the constricted region of the first terminal. The magnitude of the signal is proportional to the amount of current flowing in the constricted region of the first terminal. A method of manufacturing the module also is described.

Semiconductor module with external power sensor

An apparatus comprises a switch and a capacitor connected to the switch and to a gate driver that drives a gate of a solid state device. The gate driver is operated to perform a test sequence for the solid state device. The test sequence includes turning on a switch and charging a capacitor to a supply voltage during an initial phase. During a first phase, the switch and the solid state device are turned off, the gate driver is disconnected from the supply voltage, and the gate driver drives the gate of the solid state device based at least upon a charge of the capacitor. During a second phase, the gate driver drives the gate of the solid state device to turn on the solid state device. A gate charge at the gate of the solid state device is measured as an operational state of the solid state device.

Gate charge and leakage measurement test sequence for solid state devices

An apparatus comprises a solid state device and a switch in series with the solid state device. The apparatus comprises a leak detection component connected to the solid state device. The apparatus comprises a gate driver configured to drive a gate of the solid state device. The gate driver comprises test circuitry configured to apply a test voltage to the gate of the solid state device. The test voltage is less than a threshold voltage of the solid state device. The leak detection component is configured to detect a leakage of the solid state device.

Current leak detection for solid state devices

The present disclosure relates to a sensor system, comprising a microcontroller, at least one sensor chip designed to measure a physical quantity, wherein the microcontroller and the sensor chip are coupled to one another via at least one analog signal interface for conveying analog measurement data between the sensor chip and the microcontroller and via a bidirectional digital signal interface for conveying digital secondary information between the sensor chip and the microcontroller.

Communication between a microcontroller and at least one sensor chip

A busbar for current transport comprises conductive material, which extends along a current direction. A recess for a magnetic field sensor extends into the conductive material, a middle of the recess being shifted by a predetermined distance from a middle of the conductive material in the direction of an edge of the conductive material, so that, within a frequency range, a frequency dependency of a magnetic field, which is induced by an alternating current flowing along the current direction, is reduced in comparison with a busbar having a central recess.

Busbar and power module with busbar

A motor drive circuit provides a drive signal to an electronically commutated motor. A control circuit the motor drive circuit based on calibration data. The calibration data indicate a relationship between an actual angular position of a rotor of the motor in response to the drive signal and an expected angular position of a rotor of an ideal motor in response to the drive signal.

Generation of motor drive signals with misalignment compensation

A power module is provided that is configured to supply power to a load. The power module includes a current generator configured to generate a current; a current rail configured to receive the current and output the current from the power module, wherein the current rail includes a first opening formed therethrough, and the current, while flowing along the current rail in an output direction, flows around the first opening; and a housing that houses the current generator, wherein the housing includes an outer frame from which the current rail outwardly extends, wherein the outer frame includes a recess aligned with the first opening of the current rail such that the recess and the first opening form a unitary opening.

Coreless current sensor for high current power module

A power module is provided that is configured to supply power to a load. The power module includes a current generator, a current rail, and a magnetic sensor. The current generator is configured to generate a current. The current rail is configured to receive the current and output the current from the power module. The current rail includes a first opening formed therethrough, and the current, while flowing along the current rail in an output direction, produces a magnetic field. The magnetic sensor is disposed in the first opening of the current rail, and is configured to generate a differential sensor signal based on the magnetic field impinging thereon. The current generator is further configured to regulate the current based on the differential sensor signal.

A method may include pressing a sensor module onto a control board such that the sensor module is at an initial position where an air gap is present between a module body of the sensor module and the control board such that compliant pins of the sensor module are partially inserted into the control board. The method may include mounting the control board on a power module to cause pins of the power module to be at least partially inserted into the control board and the sensor module to be at least partially inserted in the power module such that a protrusion is through an opening in a busbar. The method may include pressing the control board onto the power module to cause the pins of the power module to be further inserted into the control board, the sensor module to be further inserted in the power module, and the sensor module to be at a final position.

Growing community of inventors

Villach, Austria

Gerald Wriessnegger