At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Gerald Weidinger

Johannes Stahr

Andreas Zluc

Markus Leitgeb

Jonathan Silvano De Sousa

Timo Schwarz

Gerhard Schmid

Günther Weichslberger

Ivan Salkovic

Gernot Grober

Gerald Weis

Heinz Moitzi

Erich Schlaffer

Wolfgang Schrittwieser

Alexander Kasper

Bernhard Reitmaier

Hannes Stahr

Sebastian Sattler

Mario Schober

Ljubomir Mareljic

Volodymyr Karpovych

Patrick Fleischhacker

Benjamin Gruber

Karl Kirchheimer

Volodymyr Karpowych

A component carrier includes a stack with electrically conductive layer structures, at least one electrically insulating layer structure, and a magnetic inlay embedded in the stack. The electrically conductive layer structures form at least part of an electrically conductive coil structure surrounding at least part of the magnetic inlay. The coil structure includes at least one vertical segment with at least one plated slot filled with electrically conductive material.

Component carrier with embedded magnetic inlay and integrated coil structure

A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having one or more pads and at least one dielectric layer on at least one main surface of the component. The at least one dielectric layer does not extend beyond the main surface in a lateral direction. The dielectric layer at least partially covers one or more pads of the component. In addition, at least one electrically conductive contact extends through at least one opening in the dielectric layer up to at least one of the pads.

Component with dielectric layer for embedding in component carrier

The disclosure pertains to a method for the bonding of a component embedded into a printed circuit board. The methods include provisions of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer. Methods may also include embedding at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer. Methods may also include application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component. Methods may also include clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist.

Printed circuit board having embedded component

A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.

Component carrier with cavity accommodating at least part of driven body being magnetically drivable to move

An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.

Inductor made of component carrier material comprising electrically conductive plate structures

A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.

Component carrier comprising embedded magnet stack

A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity

A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps:

Method for making contact with a component embedded in a printed circuit board

A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a non-uniform magnetic foil integrated in the stack.

Non-uniform magnetic foil embedded in component carrier

The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

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Leoben, Austria

Gerald Weidinger