International Business Machines Corporation

Trw Limited

Hughes Electronics Corporation

Gerald Wayne Swift

Carl W Peterson

Mir Akbar Ali

Michael John Shea

Mark J Bailey

Harry C Jones

Randolph B Heineke

David Peter Swart

Scott Allen Olson

David I Stones

Patrick J O'Sullivan

A surface laminar circuit board includes an insulating layer, and a signal ground conductive layer disposed on an upper surface of the insulating layer. The conductive layer has a hole formed therein. A photosensitive dielectric layer is disposed on an upper surface of the signal ground conductive layer. The dielectric layer has a photo micro-via formed therein. A signal trace is disposed on the photosensitive dielectric layer, and is electrically coupled with the signal ground conductive layer by way of the photo micro-via. A conductive pad is provided, which has a majority thereof within an area defined by an outer periphery of the hole. The conductive pad is electrically coupled with the signal trace. A surface mounted component is mounted on the conductive pad.

Surface laminar circuit board having pad disposed within a through hole

Method of making surface laminar circuit board

A fully balanced transimpedance amplifier for high speed and low voltage applications is provided. An input stage of the amplifier uses a matched pair of common source connected transistors with sources tied directly to ground to eliminate the Vds overhead usually found in differential pairs. The ground connection minimizes a source resistance noise component, while matching minimizes power supply noise generation and susceptibility for an array of amplifiers. Feedback resistors along with diode connected MESFETS determine the transimpedance of the amplifier. The nonlinearity of diodes helps to soften clipping. Transresistance also determined the noise generated by the amplifier, and the diode connected MESFETS offer lower noise than resistors for the same impedance. Stability is achieved through use of only a single stage of gain in a loop of the input stage, while additional gain is achieved through cascading in the input stage. A differential stage minimizes any difference in amplitude between two sides of the amplifier input stage. Two stages of source followers provide buffering to drive a relatively low impedance load at the output of the amplifier. Single integrated capacitor coupling, for high bandwidth, low noise, low voltage operation with an integrated detector is provided.

Fully balanced transimpedance amplifier for high speed and low voltage applications

A phased array (20) and method for constructing the same are disclosed. The phased array (20) includes a superstructure (22) with cavities (40) therein. A cover plate (28) is mounted to the superstructure (22) and cooperates with the cavities (40) to form cavity style filters therebetween and to form a box-beam type superstructure. Ideally, the superstructure (22) is self supporting. Electronic modules (32) and amplifiers (33) are mounted to the superstructure (22). The method includes machining a block of material to form a webbed superstructure with cavities (40) therein. A cover plate (28) is mounted to the superstructure (22) over the cavities (40) to form cavity style filters. Amplifiers (32) and antenna elements (30) are then affixed to the superstructure (22) and cover plate (28). Ideally, the cover plate (28) is affixed to the superstructure (22) using an electrically conductive adhesive. Preferably, a capacitive probe is inserted into the cavities (40) to electrically couple the filters to the antenna elements (30) and amplifiers (33).

Phased array with integrated bandpass filter superstructure

A structure for extra-high-frequency circuit modules, to take advantage of the low losses and convenience of assembly of waveguides, and at the same time to take advantage of the ease of tuning of microstrip lines. Each module is adapted to be conveniently connectable to others in a cascade arrangement, and each presents a waveguide interface to adjacent modules. If a module is to contain an active device, such as an amplifier, the module incorporates a microstrip section and two transition sections to couple the microstrip section to the waveguides at input and output. The microstrip section is easily tunable and is easier to couple to the active device.

Extra high frequency (EHF) circuit module

A microwave radial power divider/combiner device having desirably broad bandwidth response over a selected frequency range. The device includes a radial waveguide that has a number of adjoining annular sections, each of selected radial length and axial height, to provide lumped circuit parameters closely euqivalent to those of an ideal filter with the desired passband characteristics. The ideal filter is first designed using conventional synthesis techniques, then modified, if necessary, to allow its realization in radial waveguide form. The waveguide sections are selected to have lengths and uniform heights to approximate the lumped circuit parameters of the filter, and the dimensions are then optimized to provide the closest approach to the desired performance characteristics.

Radial wave power divider/combiner and related method

Growing community of inventors

Rolling Hills Estates, CA, United States of America

Gerald Wayne Swift