Motorola Corporation

Gerald W Ballard

Kevin J McDunn

Daniel R Schroeder

Robert R Kornowski

James K Gehrke

Jang-Hun (James) Yeh

James W Turocy

Thomas R Beise

Wayne C Kramer

Hans R Merz

An optical interconnect system includes a stacked arrangement of optical lightpipe layers, one layer assigned to each emitter of the system. The various optical lightpipe layers are designed to provide the same level of light to each receptor of the system. The optical lightpipe layers are very thin, allowing the emitter and receptor devices of the system to span the entire optical lightpipe layer assembly. The path loss between every emitter and every receptor over the entire system can be balanced, i.e., made substantially the same, or otherwise set as desired with respect to individual emitters and receptors.

Optical interconnect system with layered lightpipe

The apparatus includes a first housing (10) defining a first chamber (26), the first chamber sized to enclose an electronic device. The first housing has an inner surface (22) and an outer surface (24), and at least a portion of the first housing is transparent. A light-generating device (14) is disposed at least in part between the inner surface and the outer surface of the transparent portion of the first housing. The light-generating device has a first end and a second end. The first end is responsive to electrical signals (18) and the second end is responsive to optical signals (20). When a first electronic device (45) is disposed in the first chamber, the first electronic device transmits electrical signals to the first end, the second end translates the electrical signals to optical signals and transmits the optical signals through the outer surface.

Apparatus for communication by an electronic device and method for

The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28).

Apparatus and method for spray-cooling an electronic module

Growing community of inventors

West Dundee, IL, United States of America

Gerald W Ballard