Mentor Graphics Corporation

Gerald Suiter

Henry Potts

Edwin Franklin Smith

This application discloses a computing system implementing tools and mechanisms to generate a composite solid model for a set of parts and utilize the composite solid model during the layout process. The tools and mechanisms can identify multiple parts available for inclusion in a circuit design, combine component models corresponding to the multiple parts into a composite solid model, and place the composite solid model in the layout representation of the circuit design. The composite solid model can have physical dimensions that overlap with physical dimensions of the component models corresponding to the multiple parts.

Three-dimensional composite solid component modeling

This application discloses a computing system implementing tools and mechanisms to synchronize multiple layouts for a circuit design during the layout process. The tools and mechanisms can implement multiple communicating kernels, each to manage at least one of the layouts. In response to an alteration of one of the layouts, the kernels can communicate with each other, so that the kernel corresponding to the unaltered layout can automatically augment corresponding layouts for the circuit design to synchronize with the altered layout. At least one of the layouts can include a 3-dimensional layout representation of the circuit design, the tools and mechanisms can perform 3-dimensional design rule checking based on mechanical constraints and 3-dimensional solid component models in response to alterations to a 2-dimensional layout representation of the circuit design.

Circuit design layout in multiple synchronous representations

This application discloses a computing system implementing tools and mechanisms to import a three-dimensional mechanical model from a mechanical design system. The three-dimensional mechanical model includes a folded representation of a substrate having a surface for placement of electronic components and electrical connections. The tools and mechanisms can identify one or more bends in the surface of the folded representation of the substrate, and generate a two-dimensional layout representation of the substrate for an electronic design system based, at least in part, on the one or more bends in the surface of the folded representation of the substrate.

Layout synthesis of a three-dimensional mechanical system design

Techniques for enabling the dynamic reuse of printed circuit board designs are provided. A master printed circuit board design comprising a plurality of modular flexible designs is received. Additionally, a target design that includes ones of the plurality of flexible designs is identified. Subsequently, as the master design, or ones of the plurality of flexible designs within the master design, are modified, the target design is correspondingly modified. With some implementations, the master design is housed within a library. The library may be used to implement versioning capability for the flexible designs. With further implementations, the master design may itself be a target design.

Dynamic printed circuit board design reuse

Aspects of the invention are directed towards placing components within a layout design for a PCB. More specifically, various implementations of the invention provide methods and apparatuses that can dynamically adjust the shape or placement of component groups during an HGP process. With some implementations of the invention, an HGP process for planning the layout of a PCB is provided. Furthermore, component groups, which conflict, geographically, with either another component group or some other object within the layout design are allowed to be placed during the planning process. Subsequently, the placement locations for one or both of the conflicting component groups are adjusted to resolve the conflict. In some implementations, the geometric boundary, or footprint, of one or both of the component groups is adjusted to resolve the conflict.

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Madison, AL, United States of America

Gerald Suiter