Nxp B.v.

U.S. Philips Corporation

Koninklijke Philips Corporation N.v.

Quotainne Enterprises LLC

Gerald Schaffler

Joachim Heinz Schober

Marcus Toth

Heinz Kwas

Wolfgang Scheucher

Erich Merlin

Reinhard Fritz

Andreas Muehlberger

In a method for operating a transponder (), the transponder () receives a signal from a transmitter (). The signal comprises an information about a reference sensitivity and the transponder () has an input sensitivity such that the transponder () detects only signals above a certain power corresponding to the input sensitivity. In response to the received signal, the input sensitivity of the transponder () is adjusted to the reference sensitivity.

Transponders and methods for operating a transponder

A mobile communication device () comprises shielding components that provide electromagnetic shielding or attenuation between a first area (A) and a second area (B, B, B) within and/or external of the communication device (). In said first area (A) an antenna () and at least one ferrite () are arranged, which ferrite () is provided to interact with said antenna () and to guide a magnetic flux between said first area (A) and said second area (B, B, B).

Mobile communication device

An electric circuit for a communication device () for communicating with a further communication device (), the electric circuit comprising an inductive antenna element () adapted for inductively communicating with the further communication device (), a capacitive antenna element () adapted for capacitively communicating with the further communication device (), and a common matching circuit () adapted to match impedances of the inductive antenna element () and of the capacitive antenna element ().

Communication device and an electric circuit for a communication device

In a module base unit () for a module () for a data carrier, two connection plates () are provided, which comprise electrically conductive material and which each have a direction of extent () and which are separated from each other by a gap () transverse to the two directions of extent (), and at least one strain relief member () is connected to the two connection plates (), which strain relief member () is constructed to absorb tensile forces occurring parallel to the directions of extent () and acting on the connection plates ().

Module base unit with strain relief means

A module ( ) for a data carrier ( ) for performing of operations with contacts and operations without contacts comprising an integrated component ( ) with component connections (A , A , A , A , A , A , A ) and having a contact field ( ) accessible to counter contacts with module connecting contacts (C , C , C , C , C , C , C , C ), with each component connection (A , A , A , A , A ) used for operations with contacts being in an electrically conductive connection with a module connecting contact (C , C , C , C , C ) of the contact field ( ) and each component connection (A , A ) used for operations without contacts also being in an electrically conductive connection with a module connecting contact (C , C ) of the contact field ( ).

Data carrier comprising an array of contacts

The data carrier of a device provided with the data carrier includes a casing which is formed by injection molding and which accommodates a holding device for holding a chip and at least one transmission coil, and also includes an electrically conductive connector connected to the holding device and arranged to connect the chip terminals of the chip to the coil terminals of the transmission coil. The holding device includes a holding foil and the connector is realized while utilizing a conductor frame. The connector is formed by conductor segments of the conductor frame with parts of the conductor segments connected to the holding foil in order to hold the conductor segments. The entire holding foil and the parts of the conductor segments which are connected to the holding foil are fully enclosed by the casing.

Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component

The data carrier (,) of a device (,) provided with a data carrier (,) includes a casing (,) which is formed by injection molding and in which there are accommodated holding means (,) for holding a chip (,) and at least one transmission coil (,), and also includes electrically conductive connection means (,) which are connected to the holding means (,) and are arranged to connect the chip terminals (,) of the chip (,) to the coil terminals (,) of the transmission coil (,); the holding means (,) include a holding foil (,) and the connection means (,) are realized while utilizing a conductor frame (,) and are formed by conductor segments (,) of the conductor frame (,) and are completely enclosed by the casing (,), at least parts of said conductor segments (,) being connected to the holding foil (,) in order to hold said conductor segments.

Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component

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Graz, Austria

Gerald Schaffler