Laird Technologies Gmbh

Gerald Robert English

Timothy M Wrona

Allan Richard Zuehlsdorf

Joseph C Boetto

James D Pille

Vladislav Pirkhalo

Anatoliy Shlahtichman

Igor Vinokor

Eugene Smyk

Zoilo Anthony Favela

Peter John Doyle

Aleksey Pirkhalo

Jason L Strader

Eugene Anthony Pruss

John Song

Philip Van Haaster

Paul Francis Dixon

Paul W Crotty, Jr

Shelby Ball

Mohammadali Khorrami

Daniel C Green

Leonid Lev Shmagin

Paul Crotty

Woongho Bang

Mark Weiske

Daniel Jacklinski

Frame for shielding assembly

Frame for a shielding assembly

Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Thermal management assemblies suitable for use with transceivers and other devices

According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include portions alignable with and solderable to solder ball pads along a printed circuit board. A cover may be releasably attachable to, detachable from, and reattachable to the frame.

Frames for shielding assemblies and shielding assemblies including the same

A multilayer board level shield includes an electrically-conductive shielding layer disposed between inner and outer dielectric layers. The multilayer board level shield may have an overall thickness of about 25 microns or less. The multilayer board level shield may have sufficient flexibility to be reconfigurable generally over one or more components on a substrate to thereby provide board level shielding for the one or more components. One or more dielectric joints may be defined between the printed circuit board and the outer dielectric layer that attach the multilayer board level shield to the printed circuit board.

Board level shields and systems and methods of applying board level shielding

According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).

Soft and/or flexible EMI shields and related methods

A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.

Board level shield including an integrated heat sink

According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Board level shields including foil and/or film covers

According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.

Board level electromagnetic interference (EMI) shields with increased under-shield space

According to various aspects, exemplary embodiments are provided of electrical contacts, which may be used for establishing an electrical pathway between first and second electrically conductive surfaces. In an exemplary embodiment, an electrical contact may include an electrically conductive base member and at least one resilient contact member. The at least one resilient contact member may have a configuration at least partially defined by a laser cut in or into the electrically conductive base member. The at least one resilient contact member may also be formed so as to protrude outwardly from the electrically conductive base member.

Electrical contacts with laser defined geometries

A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the electrical component, and a cover is attachable to the frame for substantially covering the electrical component. The cover includes an upper surface having an inverted embossment formed therein, and a cover member extending generally downwardly from the upper surface adjacent the inverted embossment. The inverted embossment and cover member define a guide for guiding and receiving at least part of the frame into the guide when the cover is attached to the frame. The guide is configured to help facilitate and generally hold the cover in electrical contact with the frame when the cover is attached to the frame.

Electromagnetic interference shielding apparatus

According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.

EMI shielding and thermal management assemblies including frames and covers with multi-position latching

Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed generally between the substrate and the cover when the substrate is captured generally between the electrically-conductive member and the first protrusion. In addition, a compressive clamping force may be generated by the engagement of the first protrusion with the substrate and the compression of the electrically-conductive member. This compressive clamping force may mechanically retain the cover to the substrate, and also compress the electrically-conductive member against at least one electrically-conductive surface disposed on the substrate, to establish electrical conductivity therebetween that is sufficient for EMI shielding performance.

Snap install EMI shields with protrusions and electrically-conductive members for attachment to substrates

According to various aspects, exemplary embodiments are provided of clips that may be compatible with surface mount technology. The clips may be surface mountable to a substrate for allowing repeated releasable attachment and detachment of a shielding structure thereto. In one exemplary embodiment, a clip generally includes a base member having generally opposed first and second side edge portions. Two or more arms extend generally upwardly in a first direction from the base member. The clip also includes a generally flat pick-up surface configured to enable the clip to be picked up by a head associated with pick-and-place equipment.

Growing community of inventors

Glen Ellyn, IL, United States of America

Gerald Robert English